Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12261142 | Semiconductor structure including thermal enhanced bonding structure | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2025-03-25 |
| 11854936 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2023-12-26 |
| 11830844 | Semiconductor structure | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2023-11-28 |
| 11756852 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2023-09-12 |
| 11574853 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2023-02-07 |
| 11380645 | Semiconductor structure comprising at least one system-on-integrated-circuit component | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2022-07-05 |
| 11328975 | Semiconductor device | Chen-Hua Yu, Chun-Hui Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2022-05-10 |