Issued Patents All Time
Showing 1–25 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431435 | Semiconductor packages and methods of forming the same | Cheng-Yen Hsieh, Ping-Kang Huang, Sao-Ling Chiu, Yi-Jhang Wang | 2025-09-30 |
| 12341079 | Package structure and manufacturing method thereof | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2025-06-24 |
| 12283556 | Package structure | Chen-Hua Yu, Kuo-Chung Yee | 2025-04-22 |
| 12261142 | Semiconductor structure including thermal enhanced bonding structure | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2025-03-25 |
| 12224276 | 3D semiconductor packages | Chen-Hua Yu, Kuo-Chung Yee, Liang-Ju Yen | 2025-02-11 |
| 12057406 | Package having redistribution layer structure with protective layer | Chen-Hua Yu, Kuo-Chung Yee | 2024-08-06 |
| 12014993 | Package having redistribution layer structure with protective layer and method of fabricating the same | Chen-Hua Yu, Kuo-Chung Yee | 2024-06-18 |
| 11961789 | Semiconductor package and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2024-04-16 |
| 11929345 | Semiconductor device including binding agent adhering an integrated circuit device to an interposer | Chen-Hua Yu, Kuo-Chung Yee | 2024-03-12 |
| 11916028 | Package structure and method of forming the same | Chen-Hua Yu, Kuo-Chung Yee | 2024-02-27 |
| 11888285 | Low numerical aperture fiber output diode laser module | Chi-Luen Wang, Hung-Sheng Lee, Tai-Ming Chang, Yu-Ching Yeh, Sheng-Ping Lai +4 more | 2024-01-30 |
| 11854936 | Semiconductor device | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2023-12-26 |
| 11830844 | Semiconductor structure | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2023-11-28 |
| 11756852 | Semiconductor device | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2023-09-12 |
| 11640954 | Semiconductor package structure | Jeng-Nan Hung, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2023-05-02 |
| 11574853 | Semiconductor device | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2023-02-07 |
| 11545438 | Semiconductor packages and methods of forming the same | Cheng-Yen Hsieh, Ping-Kang Huang, Sao-Ling Chiu, Yi-Jhang Wang | 2023-01-03 |
| 11393805 | 3D semiconductor packages | Chen-Hua Yu, Kuo-Chung Yee, Liang-Ju Yen | 2022-07-19 |
| 11380645 | Semiconductor structure comprising at least one system-on-integrated-circuit component | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2022-07-05 |
| 11355418 | Package structure and manufacturing method thereof | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2022-06-07 |
| 11328975 | Semiconductor device | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee, Po-Fan Lin | 2022-05-10 |
| 11211336 | Integrated fan-out package and method for fabricating the same | Chen-Hua Yu, Kuo-Chung Yee | 2021-12-28 |
| 11139223 | Semiconductor device and manufacturing method thereof | Chen-Hua Yu, Jeng-Nan Hung, Kuo-Chung Yee | 2021-10-05 |
| 11075184 | Semiconductor package and method of fabricating semiconductor package | Chen-Hua Yu, Kuo-Chung Yee | 2021-07-27 |
| 11069636 | Package structure and method of forming the same | Chen-Hua Yu, Kuo-Chung Yee | 2021-07-20 |