Issued Patents All Time
Showing 51–57 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8338945 | Molded chip interposer structure and methods | Chen-Hua Yu, Jing-Cheng Lin | 2012-12-25 |
| 7911044 | RF module package for releasing stress | Wen-Kun Yang, Chihwei Lin | 2011-03-22 |
| 7884461 | System-in-package and manufacturing method of the same | Dyi-Chung Hu | 2011-02-08 |
| 7476565 | Method for forming filling paste structure of WL package | Wen-Kun Yang, Wen-Bin Sun, Hsi-Ying Yuan | 2009-01-13 |
| 7453148 | Structure of dielectric layers in built-up layers of wafer level package | Wen-Kun Yang, Chao-Nan Chou, Chih-Wei Lin, Ching-Shun Huang | 2008-11-18 |
| 7400037 | Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP | Wen-Kun Yang, Chin-Chen Yang, Cheng-hsien Chiu, Wen-Bin Sun, Kuang-Chi Chao +1 more | 2008-07-15 |
| 7279782 | FBGA and COB package structure for image sensor | Wen-Kun Yang, Chin-Chen Yang, Wen-Bin Sun, Jui-Hsien Chang, His-Ying Yuan | 2007-10-09 |