Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11145565 | Method of fabricating a chip package module with improve heat dissipation effect | Tung-Chuan Wang, Chun Yuan Hou, Ping-Lung Wang, Tzu-kuei Wen | 2021-10-12 |
| 10115673 | Embedded substrate package structure | Sung-Lien He, Chun Yuan Hou, Tung-Chuan Wang, Feng-Yi Chang | 2018-10-30 |
| 9810662 | Structure for integrating microfluidic devices and electrical biosensors | Chao-Ching Yu, Lin-Ta Chung, Ke LIAO | 2017-11-07 |
| 7476565 | Method for forming filling paste structure of WL package | Wen-Kun Yang, Wen-Bin Sun, Chun-Hui Yu | 2009-01-13 |