Issued Patents All Time
Showing 25 most recent of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9634180 | Method for forming semiconductor device package with slanting structures | — | 2017-04-25 |
| 9379081 | Semiconductor device package and method of the same | Yu-Hsiang Yang | 2016-06-28 |
| 9117941 | LED package and method of the same | Yu-Hsiang Yang | 2015-08-25 |
| 8350377 | Semiconductor device package structure and method for the same | — | 2013-01-08 |
| 8304287 | Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same | — | 2012-11-06 |
| 8299488 | LED chip | — | 2012-10-30 |
| 8237257 | Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same | — | 2012-08-07 |
| 8236608 | Stacking package structure with chip embedded inside and die having through silicon via and method of the same | — | 2012-08-07 |
| 8232633 | Image sensor package with dual substrates and the method of the same | — | 2012-07-31 |
| 8178963 | Wafer level package with die receiving through-hole and method of the same | — | 2012-05-15 |
| 8178964 | Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same | — | 2012-05-15 |
| 8115297 | Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same | — | 2012-02-14 |
| 8106504 | Stacking package structure with chip embedded inside and die having through silicon via and method of the same | — | 2012-01-31 |
| 7985626 | Manufacturing tool for wafer level package and method of placing dies | Wen-Pin Yang, Shih-Li Chen | 2011-07-26 |
| 7911044 | RF module package for releasing stress | Chun-Hui Yu, Chihwei Lin | 2011-03-22 |
| 7863105 | Image sensor package and forming method of the same | Jui-Hsien Chang | 2011-01-04 |
| 7812434 | Wafer level package with die receiving through-hole and method of the same | — | 2010-10-12 |
| 7763494 | Semiconductor device package with multi-chips and method of the same | Diann-Fang Lin | 2010-07-27 |
| 7687923 | Semiconductor device package having a back side protective scheme | Hsien-Wen Hsu | 2010-03-30 |
| 7667318 | Fan out type wafer level package structure and method of the same | Wen-Pin Yang, Shih-Li Chen | 2010-02-23 |
| 7655501 | Wafer level package with good CTE performance | Tung-Chuan Wang, Chao-Nan Chou, Chih-Wei Lin | 2010-02-02 |
| 7566854 | Image sensor module | Jui-Hsien Chang | 2009-07-28 |
| 7557437 | Fan out type wafer level package structure and method of the same | Wen-Pin Yang, Shih-Li Chen | 2009-07-07 |
| 7525139 | Image sensor with a protection layer | Chin-Chen Yang, Wen Yang, Wen-Bin Sun, Chao-Nan Chou, His-Ying Yuan +1 more | 2009-04-28 |
| 7525185 | Semiconductor device package having multi-chips with side-by-side configuration and method of the same | Diann-Fang Lin, Tung-Chuan Wang, Hsien-Wen Hsu, Chih-Ming Chen | 2009-04-28 |