Wen-Kun Yang — 53 Patents at Advanced Chip Engineering Technology

Wen-Kun Yang has been granted 53 US patents while listed as an inventor at Advanced Chip Engineering Technology. The first was granted in 2002 and the most recent in April 2017. Wen-Kun Yang ranks #48,528 of 4,157,543 US inventors in our database (top 1.2%). Patent records list Wen-Kun Yang in Hsinchu, TW.

Issued Patents All Time

Showing 1–25 of 53 patents

Patent #	Title	Co-Inventors	Date
9634180	Method for forming semiconductor device package with slanting structures	—	2017-04-25
9379081	Semiconductor device package and method of the same	Yu-Hsiang Yang	2016-06-28
9117941	LED package and method of the same	Yu-Hsiang Yang	2015-08-25
8350377	Semiconductor device package structure and method for the same	—	2013-01-08
8304287	Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same	—	2012-11-06
8299488	LED chip	—	2012-10-30
8237257	Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same	—	2012-08-07
8236608	Stacking package structure with chip embedded inside and die having through silicon via and method of the same	—	2012-08-07
8232633	Image sensor package with dual substrates and the method of the same	—	2012-07-31
8178963	Wafer level package with die receiving through-hole and method of the same	—	2012-05-15
8178964	Semiconductor device package with die receiving through-hole and dual build-up layers over both side-surfaces for WLP and method of the same	—	2012-05-15
8115297	Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same	—	2012-02-14
8106504	Stacking package structure with chip embedded inside and die having through silicon via and method of the same	—	2012-01-31
7985626	Manufacturing tool for wafer level package and method of placing dies	Wen-Pin Yang, Shih-Li Chen	2011-07-26
7911044	RF module package for releasing stress	Chun-Hui Yu, Chihwei Lin	2011-03-22
7863105	Image sensor package and forming method of the same	Jui-Hsien Chang	2011-01-04
7812434	Wafer level package with die receiving through-hole and method of the same	—	2010-10-12
7763494	Semiconductor device package with multi-chips and method of the same	Diann-Fang Lin	2010-07-27
7687923	Semiconductor device package having a back side protective scheme	Hsien-Wen Hsu	2010-03-30
7667318	Fan out type wafer level package structure and method of the same	Wen-Pin Yang, Shih-Li Chen	2010-02-23
7655501	Wafer level package with good CTE performance	Tung-Chuan Wang, Chao-Nan Chou, Chih-Wei Lin	2010-02-02
7566854	Image sensor module	Jui-Hsien Chang	2009-07-28
7557437	Fan out type wafer level package structure and method of the same	Wen-Pin Yang, Shih-Li Chen	2009-07-07
7525139	Image sensor with a protection layer	Chin-Chen Yang, Wen Yang, Wen-Bin Sun, Chao-Nan Chou, His-Ying Yuan +1 more	2009-04-28
7525185	Semiconductor device package having multi-chips with side-by-side configuration and method of the same	Diann-Fang Lin, Tung-Chuan Wang, Hsien-Wen Hsu, Chih-Ming Chen	2009-04-28

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Wen-Kun Yang — 53 Patents

Issued Patents All Time

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