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Manufacturing tool for wafer level package and method of placing dies |
Wen-Kun Yang, Wen-Pin Yang |
2011-07-26 |
| 7667318 |
Fan out type wafer level package structure and method of the same |
Wen-Kun Yang, Wen-Pin Yang |
2010-02-23 |
| 7557437 |
Fan out type wafer level package structure and method of the same |
Wen-Kun Yang, Wen-Pin Yang |
2009-07-07 |
| 7459781 |
Fan out type wafer level package structure and method of the same |
Wen-Kun Yang, Wen-Pin Yang |
2008-12-02 |
| 7262081 |
Fan out type wafer level package structure and method of the same |
Wen-Kun Yang, Wen-Pin Yang |
2007-08-28 |
| 7224061 |
Package structure |
Wen-Kun Yang, Wen-Bin Sun, Ming-Hui Lin, Chao-Nan Chou, Chih-Wei Lin |
2007-05-29 |
| 7196408 |
Fan out type wafer level package structure and method of the same |
Wen-Kun Yang, Wen-Pin Yang |
2007-03-27 |
| 6236567 |
Electronic device package with enhanced heat dissipation effect |
— |
2001-05-22 |
| 6096250 |
Process for releasing a runner from an electronic device package on a laminate plate |
— |
2000-08-01 |
| 6087586 |
Chip scale package |
— |
2000-07-11 |
| 6068129 |
Indicating adhesion status between substrate and encapsulant of a packaged electronic device |
— |
2000-05-30 |
| 5851337 |
Method of connecting TEHS on PBGA and modified connecting structure |
— |
1998-12-22 |