WS

Wen-Bin Sun

AT Advanced Chip Engineering Technology: 5 patents #5 of 28Top 20%
FL Fih (Hong Kong) Limited: 1 patents #329 of 652Top 55%
SC Shenzhen Futaihong Precision Industry Co.: 1 patents #292 of 602Top 50%
Overall (All Time): #849,799 of 4,157,543Top 25%
6
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
9405323 Wearable electronic device NAI-LIN YANG, Bing Zhang, Qiang Wang, SHAO-LIN YANG 2016-08-02
7525139 Image sensor with a protection layer Wen-Kun Yang, Chin-Chen Yang, Wen Yang, Chao-Nan Chou, His-Ying Yuan +1 more 2009-04-28
7476565 Method for forming filling paste structure of WL package Wen-Kun Yang, Hsi-Ying Yuan, Chun-Hui Yu 2009-01-13
7400037 Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP Wen-Kun Yang, Chin-Chen Yang, Cheng-hsien Chiu, Kuang-Chi Chao, His-Ying Yuan +1 more 2008-07-15
7279782 FBGA and COB package structure for image sensor Wen-Kun Yang, Chin-Chen Yang, Jui-Hsien Chang, Chun-Hui Yu, His-Ying Yuan 2007-10-09
7224061 Package structure Wen-Kun Yang, Shih-Li Chen, Ming-Hui Lin, Chao-Nan Chou, Chih-Wei Lin 2007-05-29