Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7525139 | Image sensor with a protection layer | Wen-Kun Yang, Chin-Chen Yang, Wen Yang, Wen-Bin Sun, Chao-Nan Chou +1 more | 2009-04-28 |
| 7400037 | Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP | Wen-Kun Yang, Chin-Chen Yang, Cheng-hsien Chiu, Wen-Bin Sun, Kuang-Chi Chao +1 more | 2008-07-15 |
| 7279782 | FBGA and COB package structure for image sensor | Wen-Kun Yang, Chin-Chen Yang, Wen-Bin Sun, Jui-Hsien Chang, Chun-Hui Yu | 2007-10-09 |