Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7655501 | Wafer level package with good CTE performance | Wen-Kun Yang, Tung-Chuan Wang, Chih-Wei Lin | 2010-02-02 |
| 7525139 | Image sensor with a protection layer | Wen-Kun Yang, Chin-Chen Yang, Wen Yang, Wen-Bin Sun, His-Ying Yuan +1 more | 2009-04-28 |
| 7453148 | Structure of dielectric layers in built-up layers of wafer level package | Wen-Kun Yang, Chun-Hui Yu, Chih-Wei Lin, Ching-Shun Huang | 2008-11-18 |
| 7224061 | Package structure | Wen-Kun Yang, Shih-Li Chen, Wen-Bin Sun, Ming-Hui Lin, Chih-Wei Lin | 2007-05-29 |