Issued Patents All Time
Showing 26–50 of 53 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7514767 | Fan out type wafer level package structure and method of the same | — | 2009-04-07 |
| 7501310 | Structure of image sensor module and method for manufacturing of wafer level package | Wen-Pin Yang | 2009-03-10 |
| 7498556 | Image sensor module having build-in package cavity and the method of the same | Diann-Fang Lin, Jui-Hsien Chang, Tung-Chuan Wang | 2009-03-03 |
| 7498646 | Structure of image sensor module and a method for manufacturing of wafer level package | Wen-Pin Yang | 2009-03-03 |
| 7476565 | Method for forming filling paste structure of WL package | Wen-Bin Sun, Hsi-Ying Yuan, Chun-Hui Yu | 2009-01-13 |
| 7468544 | Structure and process for WL-CSP with metal cover | — | 2008-12-23 |
| 7459781 | Fan out type wafer level package structure and method of the same | Wen-Pin Yang, Shih-Li Chen | 2008-12-02 |
| 7459729 | Semiconductor image device package with die receiving through-hole and method of the same | Jui-Hsien Chang, Tung-Chuan Wang | 2008-12-02 |
| 7453148 | Structure of dielectric layers in built-up layers of wafer level package | Chun-Hui Yu, Chao-Nan Chou, Chih-Wei Lin, Ching-Shun Huang | 2008-11-18 |
| 7446546 | Method and system of trace pull test | Cheng Chieh Tai | 2008-11-04 |
| 7423335 | Sensor module package structure and method of the same | Jui-Hsien Chang | 2008-09-09 |
| 7416920 | Semiconductor device protective structure and method for fabricating the same | Kuang-Chi Chao, Cheng-hsien Chiu, Chihwei Lin, Jui-Hsien Chang | 2008-08-26 |
| 7400037 | Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSP | Chin-Chen Yang, Cheng-hsien Chiu, Wen-Bin Sun, Kuang-Chi Chao, His-Ying Yuan +1 more | 2008-07-15 |
| 7342296 | Wafer street buffer layer | Jui-Hsien Chang | 2008-03-11 |
| 7339279 | Chip-size package structure and method of the same | — | 2008-03-04 |
| 7335870 | Method for image sensor protection | Jui-Hsien Chang, Hsien-Wen Hsu | 2008-02-26 |
| 7319043 | Method and system of trace pull test | Cheng Chieh Tai | 2008-01-15 |
| 7279782 | FBGA and COB package structure for image sensor | Chin-Chen Yang, Wen-Bin Sun, Jui-Hsien Chang, Chun-Hui Yu, His-Ying Yuan | 2007-10-09 |
| 7262081 | Fan out type wafer level package structure and method of the same | Wen-Pin Yang, Shih-Li Chen | 2007-08-28 |
| 7259468 | Structure of package | — | 2007-08-21 |
| 7238602 | Chip-size package structure and method of the same | — | 2007-07-03 |
| 7224061 | Package structure | Shih-Li Chen, Wen-Bin Sun, Ming-Hui Lin, Chao-Nan Chou, Chih-Wei Lin | 2007-05-29 |
| 7196408 | Fan out type wafer level package structure and method of the same | Wen-Pin Yang, Shih-Li Chen | 2007-03-27 |
| 7176567 | Semiconductor device protective structure and method for fabricating the same | Kuang-Chi Chao, Cheng-hsien Chiu, Chihwei Lin, Jui-Hsien Chang | 2007-02-13 |
| 7061106 | Structure of image sensor module and a method for manufacturing of wafer level package | Wen-Pin Yang | 2006-06-13 |