Issued Patents All Time
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11927430 | Dartboard structure and method for manufacturing the same | Huai-Fang Tsai | 2024-03-12 |
| 10651146 | Chip packaging structure and manufacturing method for the same | — | 2020-05-12 |
| 9892988 | Semiconductor packaging structure and manufacturing method for the same | Yu-Shan Hu | 2018-02-13 |
| 9887145 | Metal top stacking package structure and method for manufacturing the same | — | 2018-02-06 |
| 9646937 | Packaging structure for thin die and method for manufacturing the same | — | 2017-05-09 |
| 9607933 | Lead frame structure for quad flat no-lead package, quad flat no-lead package and method for forming the lead frame structure | — | 2017-03-28 |
| 9412722 | Multichip stacking package structure and method for manufacturing the same | — | 2016-08-09 |
| 9161446 | Micro electronic component structure | — | 2015-10-13 |
| 8962390 | Method for manufacturing a chip packaging structure | — | 2015-02-24 |
| 8749048 | Package structure | Yu-Shan Hu | 2014-06-10 |
| 8058102 | Package structure and manufacturing method thereof | Yu-Shan Hu | 2011-11-15 |
| 7763494 | Semiconductor device package with multi-chips and method of the same | Wen-Kun Yang | 2010-07-27 |
| 7525185 | Semiconductor device package having multi-chips with side-by-side configuration and method of the same | Wen-Kun Yang, Tung-Chuan Wang, Hsien-Wen Hsu, Chih-Ming Chen | 2009-04-28 |
| 7498556 | Image sensor module having build-in package cavity and the method of the same | Wen-Kun Yang, Jui-Hsien Chang, Tung-Chuan Wang | 2009-03-03 |
| 7369957 | Method and system for generating test pulses to test electronic elements | Shih-Bou Chang | 2008-05-06 |