YH

Yu-Shan Hu

UT Unimicron Technology: 6 patents #54 of 284Top 20%
AE Adl Engineering: 3 patents #1 of 10Top 10%
GE: 3 patents #10,354 of 36,430Top 30%
AT Advanced Chip Engineering Technology: 2 patents #17 of 28Top 65%
DT Dawning Leading Technology: 2 patents #2 of 2Top 100%
MP Mpi: 2 patents #57 of 183Top 35%
📍 Xihu, IN: #1 of 1 inventorsTop 100%
Overall (All Time): #217,913 of 4,157,543Top 6%
20
Patents All Time

Issued Patents All Time

Showing 1–20 of 20 patents

Patent #TitleCo-InventorsDate
12099078 Probe card and wafer testing assembly thereof Yi-Chien Tsai, Huo-Kang Hsu, Yu-Wen Chou 2024-09-24
11999661 Interface joint material based on industrial solid waste and its preparation Chonggen Pan, Jiawei Zang, Shiyang Qu, Zhigao Wei 2024-06-04
11981604 Concrete crack repair material based on nano materials and its preparation method Chonggen Pan, Shiyang Qu, Jiawei Zang 2024-05-14
11839020 Trace embedded probe device Yi-Lung Lee, Shao-Lun WEI, Yu-Wen Chou 2023-12-05
9892988 Semiconductor packaging structure and manufacturing method for the same Diann-Fang Lin 2018-02-13
9478512 Semiconductor packaging structure having stacked seed layers 2016-10-25
9111948 Method of fabricating semiconductor package structure Tzyy-Jang Tseng, Dyi-Chung Hu 2015-08-18
8749048 Package structure Diann-Fang Lin 2014-06-10
8709865 Fabrication method of packaging substrate having through-holed interposer embedded therein Dyi-Chung Hu, Tzyy-Jang Tseng 2014-04-29
8637402 Conductive line structure and the method of forming the same Ming-Chih Chen, Dyi-Chung Hu 2014-01-28
8633061 Method of fabricating package structure Tzyy-Jang Tseng, Dyi-Chung Hu 2014-01-21
8624366 Semiconductor package structure and method of fabricating the same Tzyy-Jang Tseng, Dyi-Chung Hu 2014-01-07
8513796 Package structure, fabricating method thereof, and package-on-package device thereby Tzyy-Jang Tseng, Dyi-Chung Hu 2013-08-20
8304923 Chip packaging structure Dyi-Chung Hu, Chih-Wei Lin 2012-11-06
8269337 Packaging substrate having through-holed interposer embedded therein and fabrication method thereof Dyi-Chung Hu, Tzyy-Jang Tseng 2012-09-18
8058102 Package structure and manufacturing method thereof Diann-Fang Lin 2011-11-15
7534632 Method for circuits inspection and method of the same Dyi-Chung Hu 2009-05-19
7341784 Light management film and its preparation and use Chunghei Yeung, Kevin Capaldo, Anne Herrmann, Yan Zhang, Bret Ja Chisholm +2 more 2008-03-11
7339664 System and method for inspecting a light-management film and method of making the light-management film Kevin Capaldo, Chunghei Yeung, Yan Zhang 2008-03-04
7251079 Brightness enhancement film, and methods of making and using the same Kevin Capaldo, Brian Carvill, Dennis Coyle, Chunghei Yeung, Yan Zhang 2007-07-31