WY

Wen-Kun Yang

AT Advanced Chip Engineering Technology: 35 patents #1 of 28Top 4%
KI King Dragon International: 10 patents #1 of 2Top 50%
UN Unknown: 4 patents #4,220 of 83,584Top 6%
Overall (All Time): #49,445 of 4,157,543Top 2%
53
Patents All Time

Issued Patents All Time

Showing 51–53 of 53 patents

Patent #TitleCo-InventorsDate
6818475 Wafer level package and the process of the same Eddy Mou 2004-11-16
6557244 Wafer level board/card assembly apparatus — 2003-05-06
6352868 Method and apparatus for wafer level burn-in — 2002-03-05