Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Wafer level package with good CTE performance

Wafer level package with good CTE performance

US Patent 7655501 · Granted Feb 2, 2010

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Optical film2025
Package structure2025
Open type breathing-out particles capture and filtration device2025
Fingerprint sensor device and method2025
Semiconductor package system and method2025
Force saving mechanism for circuit board installation2025
Resin composition and article made therefrom2025
Modular liquid cooling for multi-node computing systems2025
Molded semiconductor device and manufacturing method of molded semiconductor dev2025
Package structure and method of fabricating the same2025
Package structure and manufacturing method thereof2025
Package structure and manufacturing method thereof2025