Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device package having multi-chips with side-by-side configuration and method of the same

Semiconductor device package having multi-chips with side-by-side configuration and method of the same

US Patent 7525185 · Granted Apr 28, 2009

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Antireflection coatings for metasurfaces2025
Heat exchanging apparatus2025
Method of manufacturing phase shift photo masks2025
Power control method and communication device thereof2025
Semiconductor tool having controllable ambient environment processing zones2025
Detachable hinge2025
Uplink route decision method, distributed unit device and user plane function co2025
Piezoelectric device and method of forming the same2025
Liquid cooling rack assembly for computing system and telecommunication system i2025
Wireless transmission system2025
Communication method and communication device thereof2025
Self-aligned dielectric liner structure for protection in MEMS comb actuator2025