Issued Patents All Time
Showing 26–50 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11031344 | Package having redistribution layer structure with protective layer and method of fabricating the same | Chen-Hua Yu, Kuo-Chung Yee | 2021-06-08 |
| 10971475 | Semiconductor package structure | Jeng-Nan Hung, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2021-04-06 |
| 10950554 | Semiconductor packages with electromagnetic interference shielding layer and methods of forming the same | Chen-Hua Yu, Kuo-Chung Yee | 2021-03-16 |
| 10879153 | Chip package structure | Chen-Hua Yu, Kuo-Chung Yee | 2020-12-29 |
| 10879220 | Package-on-package structure and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2020-12-29 |
| 10861773 | Semiconductor package and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2020-12-08 |
| 10770428 | Semiconductor device and method | Chen-Hua Yu, Kuo-Chung Yee | 2020-09-08 |
| 10714525 | Methods and apparatus for sensor module | Kuo-Chung Yee | 2020-07-14 |
| 10515921 | Semiconductor package and method of fabricating semiconductor package | Chen-Hua Yu, Kuo-Chung Yee | 2019-12-24 |
| 10510695 | Package structure and method of forming the same | Chen-Hua Yu, Kuo-Chung Yee | 2019-12-17 |
| 10475747 | Integrated fan-out package and method for fabricating the same | Chen-Hua Yu, Kuo-Chung Yee | 2019-11-12 |
| 10373931 | Semiconductor package structure and method of manufacturing the same | Jeng-Nan Hung, Kuo-Chung Yee, Yi-Da Tsai, Wei-Hung Lin, Ming-Da Cheng +1 more | 2019-08-06 |
| 10340249 | Semiconductor device and method | Chen-Hua Yu, Kuo-Chung Yee | 2019-07-02 |
| 10283473 | Package structure and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2019-05-07 |
| 10269851 | Methods and apparatus for sensor module | Kuo-Chung Yee | 2019-04-23 |
| 10177078 | Method for forming chip package structure | Chen-Hua Yu, Kuo-Chung Yee | 2019-01-08 |
| 10157864 | Package structure and method of forming the same | Chen-Hua Yu, Kuo-Chung Yee | 2018-12-18 |
| 9966360 | Semiconductor package and manufacturing method thereof | Chen-Hua Yu, Kuo-Chung Yee | 2018-05-08 |
| 9761513 | Method of fabricating three dimensional integrated circuit | Kuo-Chung Yee | 2017-09-12 |
| 9679882 | Method of multi-chip wafer level packaging | Chih-Hang Tung, Chen-Hua Yu, Da-Yuan Shih | 2017-06-13 |
| 9583365 | Method of forming interconnects for three dimensional integrated circuit | Kuo-Chung Yee, Chen-Hua Yu, Yeong-Jyh Lin, Chia-Hsiang Lin, Liang-Ju Yen +1 more | 2017-02-28 |
| 9136293 | Methods and apparatus for sensor module | Kuo-Chung Yee | 2015-09-15 |
| 8754514 | Multi-chip wafer level package | Chih-Hang Tung, Tung-Liang Shao, Chen-Hua Yu, Da-Yuan Shih | 2014-06-17 |
| 8741691 | Method of fabricating three dimensional integrated circuit | Kuo-Chung Yee | 2014-06-03 |
| 8581402 | Molded chip interposer structure and methods | Chen-Hua Yu, Jing-Cheng Lin | 2013-11-12 |