Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12224276 | 3D semiconductor packages | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee | 2025-02-11 |
| 11393805 | 3D semiconductor packages | Chen-Hua Yu, Chun-Hui Yu, Kuo-Chung Yee | 2022-07-19 |
| 9583365 | Method of forming interconnects for three dimensional integrated circuit | Chun-Hui Yu, Kuo-Chung Yee, Chen-Hua Yu, Yeong-Jyh Lin, Chia-Hsiang Lin +1 more | 2017-02-28 |