Issued Patents All Time
Showing 1–20 of 20 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387992 | Package and method for forming the same | Yu-Sheng Lin, Chien-Tung Yu, Chin-Hua Wang, Shin-Puu Jeng | 2025-08-12 |
| 12322703 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2025-06-03 |
| 12218080 | Package structure with reinforced element | Shin-Puu Jeng, Po-Yao Lin, Shuo-Mao Chen | 2025-02-04 |
| 12094828 | Eccentric via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chia-Kuei Hsu, Po-Yao Lin, Shin-Puu Jeng | 2024-09-17 |
| 11855008 | Stacking via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2023-12-26 |
| 11670601 | Stacking via structures for stress reduction | Shu-Shen Yeh, Che-Chia Yang, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng | 2023-06-06 |
| 11605600 | Package structure with reinforced element and formation method thereof | Shin-Puu Jeng, Po-Yao Lin, Shuo-Mao Chen | 2023-03-14 |
| 11251142 | Method of fabricating package structure | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Arunima Banerjee | 2022-02-15 |
| 11107801 | Multi fan-out package structure and method for forming the same | Shin-Puu Jeng, Po-Yao Lin, Shuo-Mao Chen, Feng-Cheng Hsu | 2021-08-31 |
| 11038358 | Charger circuit with battery protection mechanism | Kuo-Chang Lo, Chih-Chien Huang | 2021-06-15 |
| 10665473 | Package structure and method of fabricating the same | Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng, Arunima Banerjee | 2020-05-26 |
| 9973075 | Method for performing adaptive input current control in an electronic device with aid of adaptor management, and associated apparatus | Nien-Hui Kung, Kuo-Chang Lo | 2018-05-15 |
| 9583365 | Method of forming interconnects for three dimensional integrated circuit | Chun-Hui Yu, Kuo-Chung Yee, Chen-Hua Yu, Yeong-Jyh Lin, Liang-Ju Yen +1 more | 2017-02-28 |
| 8917062 | Charging control circuit | Chien-Ping Lu, Nien-Hui Kung, Li-Wei Lee, Chen-Hsiang Hsiao, Ko-Ching Su | 2014-12-23 |
| 8563231 | Patterning process and materials for lithography | Chien-Wei Wang, Ko-Bin Kao, Wei-Liang Lin, Jui-Ching Wu, Ai-Jen Jung | 2013-10-22 |
| 8132503 | Method and apparatus for planarizing gap-filling material | Kuei-Shun Chen, Chin-Hsiang Lin, T. Lin | 2012-03-13 |
| 8119992 | System for overlay measurement in semiconductor manufacturing | Hsiao-Tzu Lu, Chin-Hsiang Lin, Hua-Shu Wu, Kuei-Shun Chen | 2012-02-21 |
| 7582538 | Method of overlay measurement for alignment of patterns in semiconductor manufacturing | Hsiao-Tzu Lu, Chin-Hsiang Lin, Hua-Shu Wu, Kuei-Shun Chen | 2009-09-01 |
| 7480865 | Auxiliary operation interface of digital recording and reproducing apparatus | — | 2009-01-20 |
| 7226873 | Method of improving via filling uniformity in isolated and dense via-pattern regions | Yung-Sung Yen, Kuei-Shun Chen, Lawrence Lin, Tsung-Hsien Lin | 2007-06-05 |