Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12387992 | Package and method for forming the same | Yu-Sheng Lin, Chia-Hsiang Lin, Chin-Hua Wang, Shin-Puu Jeng | 2025-08-12 |
| 9915983 | Drive carrier coupling system | Yen Ming Wu, Ju-Hao Lee | 2018-03-13 |
| 7459386 | Method for forming solder bumps of increased height | Li-Hsin Tseng, Gil Huang, Huei-Mei Yu, Chia-Jen Cheng, Ken Sun +4 more | 2008-12-02 |
| 7378724 | Cavity structure for semiconductor structures | Hsiu-Mei Yu, Gil Huang, Owen Chen | 2008-05-27 |