Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8669658 | Crosstalk-free WLCSP structure for high frequency application | Mon-Chin Tsai, Hsiu-Mei Yo, Chien-Min Lin, Chia-Jen Cheng | 2014-03-11 |
| 8355628 | Compact camera module | Shin-Chang Shiung, Chieh-Yuan Cheng | 2013-01-15 |
| 7964936 | Electronic device package with electromagnetic compatibility (EMC) coating thereon | Shin-Chang Shiung, Tzu-Han Lin, Chieh-Yuan Cheng | 2011-06-21 |
| 7459386 | Method for forming solder bumps of increased height | Gil Huang, Huei-Mei Yu, Chia-Jen Cheng, Ken Sun, Chien-Tung Yu +4 more | 2008-12-02 |
| 7187078 | Bump structure | Tzu-Han Lin, Huei-Mei Yu, Chia-Jen Cheng, Chun-Yen Lo, Boe Su +1 more | 2007-03-06 |
| 7122458 | Method for fabricating pad redistribution layer | Chia-Jen Cheng, Hui-Mei Yu, Tzu-Han Lin, Ching-Chiang WU, Chun-Yen Lo +2 more | 2006-10-17 |
| 6696356 | Method of making a bump on a substrate without ribbon residue | Hsiu-Mei Yu, Ta-Yang Lin, Fang-Chung Liu, Kai-Ming Ching, Tung-Heng Shie | 2004-02-24 |
| 6486054 | Method to achieve robust solder bump height | Yang-Tung Fan, Hsiu-Mei Yu, Kuang-Peng Lin, Ta-Yang Lin | 2002-11-26 |