Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6941957 | Method and apparatus for pretreating a substrate prior to electroplating | Kuo-Feng Chen, Hsiu-Mei Yu, Charles Tseng | 2005-09-13 |
| 6784002 | Method to make wafer laser marks visable after bumping process | Hui Wang, Kuo-Wei Lin, Hwei-Mei Yu, Charles Tseng | 2004-08-31 |
| 6696356 | Method of making a bump on a substrate without ribbon residue | Li-Hsin Tseng, Hsiu-Mei Yu, Fang-Chung Liu, Kai-Ming Ching, Tung-Heng Shie | 2004-02-24 |
| 6624060 | Method and apparatus for pretreating a substrate prior to electroplating | Kuo-Feng Chen, Hsiu-Mei Yu, Charles Tseng | 2003-09-23 |
| 6486054 | Method to achieve robust solder bump height | Yang-Tung Fan, Hsiu-Mei Yu, Li-Hsin Tseng, Kuang-Peng Lin | 2002-11-26 |