Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12227983 | Automatic vehicle-door activating sensing system and method therefor | Chun-Yen Chen | 2025-02-18 |
| 10082349 | Heat conducting module | Chi-Chuan Wang | 2018-09-25 |
| 8942099 | Method and apparatus of IP flow mobility in 4G wireless communication networks | Shu-Hao Yeh, Po-Han Chiang, Wan-Jiun Liao, Chao-Chin Chou | 2015-01-27 |
| 7884471 | Solder bump and related intermediate structure having primary and secondary portions and method of manufacturing same | Yu-Ying Tsai, Shih-Ming Chen | 2011-02-08 |
| 7485906 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen +1 more | 2009-02-03 |
| 7183598 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen +1 more | 2007-02-27 |
| 7119002 | Solder bump composition for flip chip | — | 2006-10-10 |
| 6977213 | IC chip solder bump structure and method of manufacturing same | Yu-Ying Tsai, Shih-Ming Chen | 2005-12-20 |
| 6958546 | Method for dual-layer polyimide processing on bumping technology | Fu-Jier Fan, Cheng-Yu Chu, Shih-Jang Lin, Yang-Tung Fran, Chiou-Shian Peng | 2005-10-25 |
| 6956292 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng +1 more | 2005-10-18 |
| 6936923 | Method to form very a fine pitch solder bump using methods of electroplating | Cheng-Yu Chu, Yen-Ming Chen, Yang-Tung Fan, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2005-08-30 |
| 6876049 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen +1 more | 2005-04-05 |
| 6784002 | Method to make wafer laser marks visable after bumping process | Hui Wang, Hwei-Mei Yu, Ta-Yang Lin, Charles Tseng | 2004-08-31 |
| 6756184 | Method of making tall flip chip bumps | Chiou-Shian Peng, Euegene Chu, Alex Fahn, Kenneth Chenghao Lin, Gilbert Fane +1 more | 2004-06-29 |
| 6649507 | Dual layer photoresist method for fabricating a mushroom bumping plating structure | Yen-Ming Chen, Cheng-Yu Chu, Chiou-Shian Peng, Yang-Tung Fan, Fu-Jier Fan +1 more | 2003-11-18 |
| 6632700 | Method to form a color image sensor cell while protecting the bonding pad structure from damage | Yang-Tung Fan, Cheng-Yu Chu, Chiou-Shian Peng, Shih-Jane Lin, Yen-Ming Chen +1 more | 2003-10-14 |
| 6605524 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Cheng-Yu Chu, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng +1 more | 2003-08-12 |
| 6586323 | Method for dual-layer polyimide processing on bumping technology | Fu-Jier Fan, Cheng-Yu Chu, Shih-Jang Lin, Yang-Tung Fan, Chiou-Shian Peng | 2003-07-01 |
| 6583039 | Method of forming a bump on a copper pad | Yen-Ming Chen, Cheng-Yu Chu, Yang-Tung Fan, Fu-Jier Fan, Shih-Jane Lin +2 more | 2003-06-24 |
| 6534396 | Patterned conductor layer pasivation method with dimensionally stabilized planarization | Fu-Jier Fahn, James Chieh-Tsung Chen, Eugene Cheu, Chien-Shian Peng, Gilbert Fan +1 more | 2003-03-18 |
| 6482669 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Shih-Jane Lin, Yen-Ming Chen +1 more | 2002-11-19 |
| 6426281 | Method to form bump in bumping technology | Cheng-Yu Chu, Yen-Ming Chen, Yang-Tung Fan, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6426283 | Method for bumping and backlapping a semiconductor wafer | Yen-Ming Chen, Cheng-Yu Chu, Fu-Jier Fan, Yang-Tung Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6372545 | Method for under bump metal patterning of bumping process | Fu-Jier Fan, Yen-Ming Chen, Cheng-Yu Chu, Shih-Jane Lin, Chiou-Shian Peng +1 more | 2002-04-16 |
| 6319846 | Method for removing solder bodies from a semiconductor wafer | James Chieh-Tsung Chen, Eugene Chu, Alex Fahn, Chiou-Shian Peng, Gilbert Fane +1 more | 2001-11-20 |