Issued Patents All Time
Showing 1–12 of 12 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7816169 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Yen-Ming Chen, Fu-Jier Fan +1 more | 2010-10-19 |
| 7485906 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Yen-Ming Chen, Fu-Jier Fan +1 more | 2009-02-03 |
| 7183598 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Yen-Ming Chen, Fu-Jier Fan +1 more | 2007-02-27 |
| 6956292 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Cheng-Yu Chu, Fu-Jier Fan, Chiou-Shian Peng, Yen-Ming Chen +1 more | 2005-10-18 |
| 6876049 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Yen-Ming Chen, Fu-Jier Fan +1 more | 2005-04-05 |
| 6649507 | Dual layer photoresist method for fabricating a mushroom bumping plating structure | Yen-Ming Chen, Cheng-Yu Chu, Kuo-Wei Lin, Chiou-Shian Peng, Yang-Tung Fan +1 more | 2003-11-18 |
| 6632700 | Method to form a color image sensor cell while protecting the bonding pad structure from damage | Yang-Tung Fan, Cheng-Yu Chu, Chiou-Shian Peng, Yen-Ming Chen, Fu-Jier Fan +1 more | 2003-10-14 |
| 6605524 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Cheng-Yu Chu, Fu-Jier Fan, Chiou-Shian Peng, Yen-Ming Chen +1 more | 2003-08-12 |
| 6583039 | Method of forming a bump on a copper pad | Yen-Ming Chen, Kuo-Wei Lin, Cheng-Yu Chu, Yang-Tung Fan, Fu-Jier Fan +2 more | 2003-06-24 |
| 6482669 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Cheng-Yu Chu, Yen-Ming Chen, Fu-Jier Fan +1 more | 2002-11-19 |
| 6426283 | Method for bumping and backlapping a semiconductor wafer | Yen-Ming Chen, Kuo-Wei Lin, Cheng-Yu Chu, Fu-Jier Fan, Yang-Tung Fan +1 more | 2002-07-30 |
| 6372545 | Method for under bump metal patterning of bumping process | Fu-Jier Fan, Kuo-Wei Lin, Yen-Ming Chen, Cheng-Yu Chu, Chiou-Shian Peng +1 more | 2002-04-16 |