Issued Patents All Time
Showing 1–23 of 23 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11654529 | Burr trimming device | Zhi-Xiang Chen, Chia-Chung Sung, Jao-Hao Chen | 2023-05-23 |
| 7816169 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2010-10-19 |
| 7485906 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2009-02-03 |
| 7183598 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2007-02-27 |
| 6958546 | Method for dual-layer polyimide processing on bumping technology | Fu-Jier Fan, Kuo-Wei Lin, Shih-Jang Lin, Yang-Tung Fran, Chiou-Shian Peng | 2005-10-25 |
| 6956292 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng, Yen-Ming Chen +1 more | 2005-10-18 |
| 6936923 | Method to form very a fine pitch solder bump using methods of electroplating | Kuo-Wei Lin, Yen-Ming Chen, Yang-Tung Fan, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2005-08-30 |
| 6876049 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2005-04-05 |
| 6765277 | Microelectronic fabrication with corrosion inhibited bond pad | Yen-Ming Chen, Chia-Fu Lin, Yang-Tung Fan, Hong-Wen Huang | 2004-07-20 |
| 6712260 | Bump reflow method by inert gas plasma | Wen-Chang Kuo, Chia-Fu Lin, Sheng-Liang Pan, Szu-Yao Wang | 2004-03-30 |
| 6649507 | Dual layer photoresist method for fabricating a mushroom bumping plating structure | Yen-Ming Chen, Kuo-Wei Lin, Chiou-Shian Peng, Yang-Tung Fan, Fu-Jier Fan +1 more | 2003-11-18 |
| 6632700 | Method to form a color image sensor cell while protecting the bonding pad structure from damage | Yang-Tung Fan, Chiou-Shian Peng, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2003-10-14 |
| 6605524 | Bumping process to increase bump height and to create a more robust bump structure | Yang-Tung Fan, Fu-Jier Fan, Shih-Jane Lin, Chiou-Shian Peng, Yen-Ming Chen +1 more | 2003-08-12 |
| 6586323 | Method for dual-layer polyimide processing on bumping technology | Fu-Jier Fan, Kuo-Wei Lin, Shih-Jang Lin, Yang-Tung Fan, Chiou-Shian Peng | 2003-07-01 |
| 6583039 | Method of forming a bump on a copper pad | Yen-Ming Chen, Kuo-Wei Lin, Yang-Tung Fan, Fu-Jier Fan, Shih-Jane Lin +2 more | 2003-06-24 |
| 6482669 | Colors only process to reduce package yield loss | Yang-Tung Fan, Chiou-Shian Peng, Shih-Jane Lin, Yen-Ming Chen, Fu-Jier Fan +1 more | 2002-11-19 |
| 6468704 | Method for improved photomask alignment after epitaxial process through 90° orientation change | Chi-Hung Liao, Yih-Ann Lin, Sheng-Liang Pan, Kuo-Liang Lu, Yu-Hsi Wang | 2002-10-22 |
| 6426281 | Method to form bump in bumping technology | Kuo-Wei Lin, Yen-Ming Chen, Yang-Tung Fan, Fu-Jier Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6426283 | Method for bumping and backlapping a semiconductor wafer | Yen-Ming Chen, Kuo-Wei Lin, Fu-Jier Fan, Yang-Tung Fan, Chiou-Shian Peng +1 more | 2002-07-30 |
| 6372545 | Method for under bump metal patterning of bumping process | Fu-Jier Fan, Kuo-Wei Lin, Yen-Ming Chen, Shih-Jane Lin, Chiou-Shian Peng +1 more | 2002-04-16 |
| 6338976 | Method for forming optoelectronic microelectronic fabrication with attenuated bond pad corrosion | Chieh-Chuan Huang, Shun-Liang Hsu | 2002-01-15 |
| 6242331 | Method to reduce device contact resistance using a hydrogen peroxide treatment | Te-Fu Tseng, Chai-Der Chang, Chi-Hung Liao | 2001-06-05 |
| 6238983 | Alignment dip back oxide and code implant through poly to approach the depletion mode device character | Jenq-Dong Sheu, Dean E. Lin, Yi-Jing Chu | 2001-05-29 |