Issued Patents All Time
Showing 1–17 of 17 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8497584 | Method to improve bump reliability for flip chip device | Yen-Ming Chen, Shun-Liang Hsu, Kai-Ming Ching, Hsin-Hui Lee, Chao-Yuan Su +1 more | 2013-07-30 |
| 7906425 | Fluxless bumping process | Chao-Yuan Su, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen +2 more | 2011-03-15 |
| 7468321 | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation | Kai-Ming Ching, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen, Hsin-Hui Lee +1 more | 2008-12-23 |
| 7276454 | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation | Kai-Ming Ching, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen, Hsin-Hui Lee +2 more | 2007-10-02 |
| 7134199 | Fluxless bumping process | Chao-Yuan Su, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen +2 more | 2006-11-14 |
| 6974659 | Method of forming a solder ball using a thermally stable resinous protective layer | Chao-Yuan Su, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen | 2005-12-13 |
| 6918397 | Flush system for dry film photoresist remover | Ta-Min Lin, Szu-Yao Wang, Kai-Ming Ching, Wen-Hsiang Tseng | 2005-07-19 |
| 6805279 | Fluxless bumping process using ions | Hsin-Hui Lee, Chao-Yuan Su, Yeng-Ming Chen, Kai-Ming Chin, Li-Chi Chen +1 more | 2004-10-19 |
| 6802250 | Stencil design for solder paste printing | Chao-Yuan Su, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen | 2004-10-12 |
| 6797075 | Ferris wheel-like stripping or cleaning mechanism for semiconductor fabrication | Kai-Ming Ching, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen, Hsin-Hui Lee | 2004-09-28 |
| 6765277 | Microelectronic fabrication with corrosion inhibited bond pad | Yen-Ming Chen, Yang-Tung Fan, Hong-Wen Huang, Cheng-Yu Chu | 2004-07-20 |
| 6756294 | Method for improving bump reliability for flip chip devices | Yen-Ming Chen, Shun-Liang Hsu, Kai-Ming Ching, Hsin-Hui Lee, Chao-Yuan Su +1 more | 2004-06-29 |
| 6743660 | Method of making a wafer level chip scale package | Hsin-Hui Lee, Chao-Yuan Su, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen | 2004-06-01 |
| 6715524 | DFR laminating and film removing system | Li-Chen Chen, Chia-Tsun Hsu, Kuo-Ching Lee, Yen-Ming Chen, Kai-Ming Ching +2 more | 2004-04-06 |
| 6712260 | Bump reflow method by inert gas plasma | Wen-Chang Kuo, Sheng-Liang Pan, Szu-Yao Wang, Cheng-Yu Chu | 2004-03-30 |
| 6636313 | Method of measuring photoresist and bump misalignment | Yen-Ming Chen, Kai-Ming Ching, Chao-Yuan Su, Hsin-Hui Lee, Li-Chih Chen | 2003-10-21 |
| 6602775 | Method to improve reliability for flip-chip device for limiting pad design | Yen-Ming Chen, Kai-Ming Ching, Hsin-Hui Lee, Chao-Yuan Su, Li-Chi Chen | 2003-08-05 |