Issued Patents All Time
Showing 1–10 of 10 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9205588 | Temperature measurement component embedded hot runner nozzle structure | Yuan-Shiang Lin, An-Chen Hung, Chien-Yu Ko | 2015-12-08 |
| 8497584 | Method to improve bump reliability for flip chip device | Yen-Ming Chen, Chia-Fu Lin, Shun-Liang Hsu, Kai-Ming Ching, Hsin-Hui Lee +1 more | 2013-07-30 |
| 7906425 | Fluxless bumping process | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching +2 more | 2011-03-15 |
| 7276454 | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation | Kai-Ming Ching, Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen +2 more | 2007-10-02 |
| 7134199 | Fluxless bumping process | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching +2 more | 2006-11-14 |
| 6974659 | Method of forming a solder ball using a thermally stable resinous protective layer | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching | 2005-12-13 |
| 6802250 | Stencil design for solder paste printing | Chao-Yuan Su, Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching | 2004-10-12 |
| 6756294 | Method for improving bump reliability for flip chip devices | Yen-Ming Chen, Chia-Fu Lin, Shun-Liang Hsu, Kai-Ming Ching, Hsin-Hui Lee +1 more | 2004-06-29 |
| 6743660 | Method of making a wafer level chip scale package | Hsin-Hui Lee, Chia-Fu Lin, Chao-Yuan Su, Yen-Ming Chen, Kai-Ming Ching | 2004-06-01 |
| 6636313 | Method of measuring photoresist and bump misalignment | Yen-Ming Chen, Chia-Fu Lin, Kai-Ming Ching, Chao-Yuan Su, Hsin-Hui Lee | 2003-10-21 |