Issued Patents All Time
Showing 1–25 of 32 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9691749 | Exclusion zone for stress-sensitive circuit design | Chung-Yi Lin | 2017-06-27 |
| 8829653 | Exclusion zone for stress-sensitive circuit design | Chung-Yi Lin | 2014-09-09 |
| 8629563 | Method for packaging semiconductor dies having through-silicon vias | — | 2014-01-14 |
| 8624346 | Exclusion zone for stress-sensitive circuit design | Chung-Yi Lin | 2014-01-07 |
| 8497584 | Method to improve bump reliability for flip chip device | Yen-Ming Chen, Chia-Fu Lin, Shun-Liang Hsu, Kai-Ming Ching, Hsin-Hui Lee +1 more | 2013-07-30 |
| 8124458 | Method for packaging semiconductor dies having through-silicon vias | — | 2012-02-28 |
| 7906425 | Fluxless bumping process | Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen +2 more | 2011-03-15 |
| 7892962 | Nail-shaped pillar for wafer-level chip-scale packaging | — | 2011-02-22 |
| 7825517 | Method for packaging semiconductor dies having through-silicon vias | — | 2010-11-02 |
| 7719076 | High-voltage MOS transistor device | Shih-Ming Shu, Chih-Jen Huang, Tun-Jen Cheng | 2010-05-18 |
| 7709908 | High-voltage MOS transistor device | Wei-Lun Hsu, Ching-Ming Lee, Chih-Jen Huang, Te-Yuan Wu, Chun-Hsiung Peng | 2010-05-04 |
| 7468321 | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation | Kai-Ming Ching, Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen +1 more | 2008-12-23 |
| 7294937 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Pei-Haw Tsao, Hsin-Hui Lee, Chender Huang, Shang Y. Hou, Shin-Puu Jeng +2 more | 2007-11-13 |
| 7276454 | Application of impressed-current cathodic protection to prevent metal corrosion and oxidation | Kai-Ming Ching, Chia-Fu Lin, Wen-Hsiang Tseng, Ta-Min Lin, Yen-Ming Chen +2 more | 2007-10-02 |
| 7256071 | Underfilling efficiency by modifying the substrate design of flip chips | Hsin-Hui Lee | 2007-08-14 |
| 7157734 | Semiconductor bond pad structures and methods of manufacturing thereof | Pei-Haw Tsao, Chender Huang, Shang Y. Hou, Chia-Hsiung Hsu | 2007-01-02 |
| 7154185 | Encapsulation method for SBGA | Hsin-Hui Lee, Pei-Hwa Tsao | 2006-12-26 |
| 7134199 | Fluxless bumping process | Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen +2 more | 2006-11-14 |
| 7126225 | Apparatus and method for manufacturing a semiconductor wafer with reduced delamination and peeling | Pei-Haw Tsao, Hsin-Hui Lee, Chender Huang, Shang Y. Hou, Shin-Puu Jeng +2 more | 2006-10-24 |
| 7105920 | Substrate design to improve chip package reliability | Chen-Der Huang, Pei-Haw Tsao, Chuen-Jye Lin | 2006-09-12 |
| 7098082 | Microelectronics package assembly tool and method of manufacture therewith | Hsin-Hui Lee | 2006-08-29 |
| 7075016 | Underfilling efficiency by modifying the substrate design of flip chips | Hsin-Hui Lee | 2006-07-11 |
| 6974659 | Method of forming a solder ball using a thermally stable resinous protective layer | Chia-Fu Lin, Hsin-Hui Lee, Yen-Ming Chen, Kai-Ming Ching, Li-Chih Chen | 2005-12-13 |
| 6821813 | Process for bonding solder bumps to a substrate | — | 2004-11-23 |
| 6805279 | Fluxless bumping process using ions | Hsin-Hui Lee, Chia-Fu Lin, Yeng-Ming Chen, Kai-Ming Chin, Li-Chi Chen +1 more | 2004-10-19 |