Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7154185 | Encapsulation method for SBGA | Hsin-Hui Lee, Chao-Yuan Su | 2006-12-26 |
| 6372619 | Method for fabricating wafer level chip scale package with discrete package encapsulation | Chender Huang | 2002-04-16 |