Issued Patents All Time
Showing 1–25 of 57 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11989966 | Semiconductor devices and methods for forming the same | Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen +3 more | 2024-05-21 |
| 11621287 | Optical sensor device with reduced thickness and method for forming the same | Han-Liang Tseng, Hsueh-Jung Lin | 2023-04-04 |
| 11482552 | Semiconductor devices and methods for forming the same | Han-Liang Tseng, Hsueh-Jung Lin | 2022-10-25 |
| 11315964 | Optical sensors and methods for forming the same | Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen +3 more | 2022-04-26 |
| 11271024 | Semiconductor device and method for forming the same | Han-Liang Tseng, Hsueh-Jung Lin, Chin-Cheng Li | 2022-03-08 |
| 11177397 | Semiconductor devices and methods for forming the same | Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen +3 more | 2021-11-16 |
| 11152422 | Semiconductor devices and methods for forming the same | Han-Liang Tseng, Hsueh-Jung Lin, Chin-Cheng Li | 2021-10-19 |
| 11049771 | Semiconductor device and fingerprint identification device | Han-Liang Tseng, Hsueh-Jung Lin | 2021-06-29 |
| 10935805 | Optical sensor and method for forming the same | Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen +3 more | 2021-03-02 |
| 10915727 | Optical sensor and method for forming the same | Han-Liang Tseng, Hsueh-Jung Lin | 2021-02-09 |
| 10770602 | Optical sensor and method for forming the same | Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen +3 more | 2020-09-08 |
| 10763288 | Semiconductor device and method for forming the same | Han-Liang Tseng, Jiunn-Liang Yu, Kwang-Ming Lin, Yin Chen, Si-Twan Chen +3 more | 2020-09-01 |
| 10699092 | Optical sensor and manufacturing method thereof | Han-Liang Tseng | 2020-06-30 |
| 10651218 | Optical sensor structure and method for forming the same | Han-Liang Tseng, Hsueh-Jung Lin | 2020-05-12 |
| 10572070 | Optical devices and fabrication method thereof | Chih-Cherng Liao, Shih-Hao Liu, Wu-Hsi Lu, Ming-Cheng Lo, Chung-Ren Lao +5 more | 2020-02-25 |
| 9904302 | Proactive pressure stabilizing system and method | — | 2018-02-27 |
| 9812409 | Seal ring structure with a metal pad | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Shu-Ting Tsai | 2017-11-07 |
| 9064817 | Structure of wafer level chip molded package | William Cheng | 2015-06-23 |
| 9035445 | Seal ring structure with a metal pad | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Shu-Ting Tsai | 2015-05-19 |
| 8647963 | Structure and method of wafer level chip molded packaging | William Cheng | 2014-02-11 |
| 8524595 | Semiconductor package structures | Mirng-Ji Lii | 2013-09-03 |
| 8497584 | Method to improve bump reliability for flip chip device | Yen-Ming Chen, Chia-Fu Lin, Shun-Liang Hsu, Kai-Ming Ching, Chao-Yuan Su +1 more | 2013-07-30 |
| 8409881 | Multi-project wafer and method of making same | William Cheng, Mirng-Ji Lii, Chen Yung Ching | 2013-04-02 |
| 8288842 | Method for dicing semiconductor wafers | Chien-Chao Huang, Chao-Hsiung Wang, Fu-Liang Yang, Chenming Hu | 2012-10-16 |
| 8283754 | Seal ring structure with metal pad | Jeng-Shyan Lin, Dun-Nian Yaung, Jen-Cheng Liu, Wen-De Wang, Shu-Ting Tsai | 2012-10-09 |