Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9105552 | Package on package devices and methods of packaging semiconductor dies | Chen-Hua Yu, Chien-Hsiun Lee | 2015-08-11 |
| 8409881 | Multi-project wafer and method of making same | William Cheng, Mirng-Ji Lii, Hsin-Hui Lee | 2013-04-02 |
| 7851272 | Multi-project wafer and method of making same | William Cheng, Mirng-Ji Lii, Hsin-Hui Lee | 2010-12-14 |