Issued Patents All Time
Showing 1–25 of 44 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10777431 | Post-passivation interconnect structure and method of forming the same | Hung-Jen Lin, Tsung-Ding Wang | 2020-09-15 |
| 10665565 | Package assembly | Hung-Jen Lin, Tsung-Ding Wang, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2020-05-26 |
| 10453815 | Methods and apparatus for solder connections | Chen-Hua Yu, Hao-Yi Tsai, Chung-Shi Liu, Hsien-Wei Chen | 2019-10-22 |
| 10192848 | Package assembly | Hung-Jen Lin, Tsung-Ding Wang, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2019-01-29 |
| 10163877 | System in package process flow | Tsung-Ding Wang | 2018-12-25 |
| 9905520 | Solder ball protection structure with thick polymer layer | Chen-Hua Yu, Lawrence Chiang Sheu, Hao-Yi Tsai | 2018-02-27 |
| 9780064 | Method of forming package assembly | Hung-Jen Lin, Tsung-Ding Wang, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2017-10-03 |
| 9768105 | Rigid interconnect structures in package-on-package assemblies | Mirng-Ji Lii, Chen-Hua Yu, Yung Ching Chen, Jiun Yi Wu | 2017-09-19 |
| 9515036 | Methods and apparatus for solder connections | Chen-Hua Yu, Hao-Yi Tsai, Chung-Shi Liu, Hsien-Wei Chen | 2016-12-06 |
| 9449941 | Connecting function chips to a package to form package-on-package | Pei-Chun Tsai, Sheng-Yu Wu, Ching-Wen Hsiao, Tin-Hao Kuo, Chen-Shien Chen +2 more | 2016-09-20 |
| 9240387 | Wafer-level chip scale package with re-workable underfill | Hsien-Wei Chen, Tsung-Ding Wang, Hao-Yi Tsai, Mirng-Ji Lii, Chen-Hua Yu | 2016-01-19 |
| 9105552 | Package on package devices and methods of packaging semiconductor dies | Chen-Hua Yu, Chen Yung Ching | 2015-08-11 |
| 9059109 | Package assembly and method of forming the same | Hung-Jen Lin, Tsung-Ding Wang, Wen-Hsiung Lu, Ming-Da Cheng, Chung-Shi Liu | 2015-06-16 |
| 8987605 | Formation of connectors without UBM | Tsung-Ding Wang, Hung-Jen Lin | 2015-03-24 |
| 8932906 | Through silicon via bonding structure | Dean Wang, Chen-Shien Chen, Kai-Ming Ching, Bo-I Lee | 2015-01-13 |
| 8823180 | Package on package devices and methods of packaging semiconductor dies | Tsung-Ding Wang, Ming-Chung Sung, Jiun Yi Wu, Mirng-Ji Lii | 2014-09-02 |
| 8743561 | Wafer-level molded structure for package assembly | Tsung-Ding Wang, Bo-I Lee | 2014-06-03 |
| 8703539 | Multiple die packaging interposer structure and method | Chen-Hua Yu, Mirng-Ji Lii, Hao-Yi Tsai, Jui-Pin Hung, Kai-Chiang Wu | 2014-04-22 |
| 8664039 | Methods and apparatus for alignment in flip chip bonding | Ming-Chung Sung, Yu-Chih Liu, Wei-Ting Lin | 2014-03-04 |
| 8658464 | Mold chase design for package-on-package applications | Jung Wei Cheng, Tsung-Ding Wang, Chun-Chih Chuang | 2014-02-25 |
| 8652939 | Method and apparatus for die assembly | Ming-Chung Sung, Yu-Chih Liu, Wei-Ting Lin | 2014-02-18 |
| 8597986 | System in package and method of fabricating same | Tsung-Ding Wang | 2013-12-03 |
| 8551813 | Wafer level IC assembly method | Clinton Chao, Mirng-Ji Lii, Tjandra Winata Karta | 2013-10-08 |
| 8492263 | Protected solder ball joints in wafer level chip-scale packaging | Chung Yu Wang, Pei-Haw Tsao, Kuo-Chin Chang, Chung-Yi Lin, Bill Kiang | 2013-07-23 |
| 8426256 | Method of forming stacked-die packages | C. W. Hsiao, Bo-I Lee, Tsung-Ding Wang, Kai-Ming Ching, Chen-Shien Chen +1 more | 2013-04-23 |