Issued Patents All Time
Showing 1–25 of 55 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11961810 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2024-04-16 |
| 11908818 | Semiconductor device | Ching-Hui Chen, Mirng-Ji Lii, Kai-Di Wu, Chien-Hung Kuo, Chao-Yi Wang +3 more | 2024-02-20 |
| 11824026 | Connector structure and method of forming same | Chen-Shien Chen, Mirng-Ji Lii, Chita Chuang | 2023-11-21 |
| 11812646 | Display device and manufacturing method thereof | Mirng-Ji Lii, Shang-Yun Tu, Ching-Hui Chen | 2023-11-07 |
| 11658143 | Bump-on-trace design for enlarge bump-to-trace distance | Tin-Hao Kuo, Chen-Shien Chen | 2023-05-23 |
| 11315896 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Chen-Hua Yu, Yao-Chun Chuang | 2022-04-26 |
| 11239305 | Display device and manufacturing method thereof | Mirng-Ji Lii, Shang-Yun Tu, Ching-Hui Chen | 2022-02-01 |
| 11177228 | Semiconductor device and bump formation process | Ching-Hui Chen, Mirng-Ji Lii, Kai-Di Wu, Chien-Hung Kuo, Chao-Yi Wang +3 more | 2021-11-16 |
| 11152273 | Conductive structures and redistribution circuit structures | Shang-Yun Tu, Ching-Wen Hsiao, Ching-Hui Chen | 2021-10-19 |
| 11043462 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2021-06-22 |
| 10985114 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen | 2021-04-20 |
| 10861811 | Connector structure and method of forming same | Chen-Shien Chen, Mirng-Ji Lii, Chita Chuang | 2020-12-08 |
| 10734347 | Dummy flip chip bumps for reducing stress | Tin-Hao Kuo, Chita Chuang, Chen-Shien Chen | 2020-08-04 |
| 10629509 | Redistribution circuit structures and methods of forming the same | Shang-Yun Tu, Ching-Wen Hsiao, Ching-Hui Chen | 2020-04-21 |
| 10515919 | Bump-on-trace design for enlarge bump-to-trace distance | Tin-Hao Kuo, Chen-Shien Chen | 2019-12-24 |
| 10504856 | Scheme for connector site spacing and resulting structures | Yu-Feng Chen, Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen | 2019-12-10 |
| 10388620 | Connector structure and method of forming same | Chen-Shien Chen, Mirng-Ji Lii, Chita Chuang | 2019-08-20 |
| 10319695 | Semiconductor device and bump formation process | Ching-Hui Chen, Mirng-Ji Lii, Kai-Di Wu, Chien-Hung Kuo, Chao-Yi Wang +3 more | 2019-06-11 |
| 10319691 | Solderless interconnection structure and method of forming same | Yu-Wei Lin, Yu-Jen Tseng, Tin-Hao Kuo, Chen-Shien Chen | 2019-06-11 |
| 10290600 | Dummy flip chip bumps for reducing stress | Tin-Hao Kuo, Chita Chuang, Chen-Shien Chen | 2019-05-14 |
| 10163844 | Semiconductor device having conductive bumps of varying heights | Yen-Liang Lin, Tin-Hao Kuo, Chen-Shien Chen | 2018-12-25 |
| 10163842 | Semiconductor structure and manufacturing method thereof | Chien-Hung Kuo, Chin-Yu Ku, Yuh-Sen Chang, Hon-Lin Huang, Ching-Hui Chen +1 more | 2018-12-25 |
| 10157874 | Contact area design for solder bonding | Pei-Chun Tsai, Yu-Feng Chen, Tin-Hao Kuo, Chen-Shien Chen, Yu-Chih Huang | 2018-12-18 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Bor-Ping Jang, Ming-Da Cheng, Chung-Shi Liu +6 more | 2018-11-20 |
| 10056345 | Conical-shaped or tier-shaped pillar connections | Tin-Hao Kuo, Chen-Shien Chen, Mirng-Ji Lii, Chen-Hua Yu, Yao-Chun Chuang | 2018-08-21 |