Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12113055 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Chun Liu, Chen-Cheng Kuo, Chen-Shien Chen | 2024-10-08 |
| 11855025 | Semiconductor device and package assembly including the same | Yao-Chun Chuang, Tsung-Shu Lin, Chen-Cheng Kuo, Chen-Shien Chen | 2023-12-26 |
| 11824026 | Connector structure and method of forming same | Chen-Shien Chen, Sheng-Yu Wu, Mirng-Ji Lii | 2023-11-21 |
| 11631993 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chen-Hua Yu, Chen-Shien Chen, Ming Hung Tseng, Sen-Kuei Hsu, Yu-Feng Chen +1 more | 2023-04-18 |
| 11244940 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Chun Liu, Chen-Cheng Kuo, Chen-Shien Chen | 2022-02-08 |
| 11088102 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu +1 more | 2021-08-10 |
| 10867810 | Substrate pad structure | Hao-Juin Liu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2020-12-15 |
| 10861811 | Connector structure and method of forming same | Chen-Shien Chen, Sheng-Yu Wu, Mirng-Ji Lii | 2020-12-08 |
| 10784223 | Elongated bump structures in package structure | Yao-Chun Chuang, Chen-Shien Chen, Ming Hung Tseng | 2020-09-22 |
| 10748785 | Substrate pad structure | Hao-Juin Liu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2020-08-18 |
| 10734347 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2020-08-04 |
| 10720788 | Wireless charging devices having wireless charging coils and methods of manufacture thereof | Chen-Hua Yu, Chen-Shien Chen, Ming Hung Tseng, Sen-Kuei Hsu, Yu-Feng Chen +1 more | 2020-07-21 |
| 10692848 | Stress reduction apparatus and method | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Chun Liu, Chen-Cheng Kuo, Chen-Shien Chen | 2020-06-23 |
| 10515917 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2019-12-24 |
| 10483225 | Packaging assembly and method of making the same | Yao-Chun Chunag, Tsung-Shu Lin, Chen-Cheng Kuo, Chen-Shien Chen | 2019-11-19 |
| 10468366 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu +1 more | 2019-11-05 |
| 10388620 | Connector structure and method of forming same | Chen-Shien Chen, Sheng-Yu Wu, Mirng-Ji Lii | 2019-08-20 |
| 10290600 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2019-05-14 |
| 10163839 | Bump on pad (BOP) bonding structure in semiconductor packaged device | Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2018-12-25 |
| 10037973 | Method for manufacturing semiconductor package structure | Hua-Wei Tseng, Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen +1 more | 2018-07-31 |
| 9905524 | Bump structures in semiconductor device and packaging assembly | Yao-Chun Chuang, Tsung-Shu Lin, Chen-Cheng Kuo, Chen-Shien Chen | 2018-02-27 |
| 9881885 | Metal routing architecture for integrated circuits | Chen-Cheng Kuo, Chih-Hua Chen, Chen-Shien Chen, Yao-Chun Chuang | 2018-01-30 |
| 9786621 | Elongated bump structures in package structure | Chen-Shien Chen, Ming Hung Tseng, Yao-Chun Chuang | 2017-10-10 |
| 9748188 | Method of forming a bump on pad (BOP) bonding structure in a semiconductor packaged device | Chen-Cheng Kuo, Chen-Shien Chen, Yao-Chun Chuang | 2017-08-29 |
| 9741589 | Substrate pad structure | Hao-Juin Liu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2017-08-22 |