Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9711477 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2017-07-18 |
| 9673125 | Interconnection structure | Hao-Juin Liu, Yao-Chun Chuang, Yu-Jen Tseng, Chen-Shien Chen | 2017-06-06 |
| 9673161 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu +1 more | 2017-06-06 |
| 9646943 | Connector structure and method of forming same | Chen-Shien Chen, Sheng-Yu Wu, Mirng-Ji Lii | 2017-05-09 |
| 9472521 | Scheme for connector site spacing and resulting structures | Yao-Chun Chuang, Hao-Juin Liu, Chen-Cheng Kuo, Chen-Shien Chen | 2016-10-18 |
| 9406629 | Semiconductor package structure and manufacturing method thereof | Hua-Wei Tseng, Shang-Yun Tu, Hsu-Hsien Chen, Hao-Juin Liu, Chen-Shien Chen +1 more | 2016-08-02 |
| 9397059 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Tsung-Hsien Chiang, Hao-Juin Liu +1 more | 2016-07-19 |
| 9287234 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2016-03-15 |
| 9287191 | Semiconductor device package and method | Hao-Juin Liu, Chen-Cheng Kuo, Chen-Shien Chen | 2016-03-15 |
| 9257412 | Stress reduction apparatus | Yao-Chun Chuang, Yu-Chen Hsu, Hao-Juin Liu, Chen-Cheng Kuo, Chen-Shien Chen | 2016-02-09 |
| 9224688 | Metal routing architecture for integrated circuits | Yao-Chun Chuang, Chih-Hua Chen, Chen-Cheng Kuo, Chen-Shien Chen | 2015-12-29 |
| 9196573 | Bump on pad (BOP) bonding structure | Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2015-11-24 |
| 9159695 | Elongated bump structures in package structure | Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2015-10-13 |
| 9123788 | Bonded structures for package and substrate | Ming-Hong Cha, Yao-Chun Chuang, Hao-Juin Liu, Tsung-Hsien Chiang, Chen-Cheng Kuo +1 more | 2015-09-01 |
| 9117825 | Substrate pad structure | Hao-Juin Liu, Yao-Chun Chuang, Ming Hung Tseng, Chen-Shien Chen | 2015-08-25 |
| 9093332 | Elongated bump structure for semiconductor devices | Tin-Hao Kuo, Yu-Feng Chen, Chen-Shien Chen, Chen-Hua Yu, Sheng-Yu Wu | 2015-07-28 |
| 9053989 | Elongated bump structure in semiconductor device | Chen-Cheng Kuo, Tsung-Shu Lin, Chen-Shien Chen | 2015-06-09 |
| 9053990 | Bump interconnection techniques | Yao-Chun Chuang, Yu-Chen Hsu, Ming Hung Tseng, Chen-Shien Chen | 2015-06-09 |
| 9040350 | Packaging and function tests for package-on-package and system-in-package structures | Hao-Juin Liu, Ching-Wen Hsiao, Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen | 2015-05-26 |
| 8912649 | Dummy flip chip bumps for reducing stress | Sheng-Yu Wu, Tin-Hao Kuo, Chen-Shien Chen | 2014-12-16 |
| 8829673 | Bonded structures for package and substrate | Ming-Hong Cha, Yao-Chun Chuang, Hao-Juin Liu, Tsung-Hsien Chiang, Chen-Cheng Kuo +1 more | 2014-09-09 |
| 8772950 | Methods and apparatus for flip chip substrate with guard rings outside of a die attach region | Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2014-07-08 |
| 8765497 | Packaging and function tests for package-on-package and system-in-package structures | Hao-Juin Liu, Ching-Wen Hsiao, Chen-Shien Chen, Chen-Cheng Kuo, Chih-Hua Chen | 2014-07-01 |
| 8659123 | Metal pad structures in dies | Yao-Chun Chuang, Chen-Cheng Kuo, Chen-Shien Chen | 2014-02-25 |
| 8623756 | Reflow system and method for conductive connections | Sheng-Yu Wu, Tin-Hao Kuo, Pei-Chun Tsai, Ming-Da Cheng, Chen-Shien Chen | 2014-01-07 |