Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406941 | Dielectric slots underneath conductive vias in interconnect structure of semiconductor package and method of forming the same | Yi-Che Chiang, Chien-Hsun Chen, Tuan-Yu Hung, Hsin-Yu Pan, Wei-Kang Hsieh +8 more | 2025-09-02 |
| 12362274 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2025-07-15 |
| 12362329 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2025-07-15 |
| 12334434 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2025-06-17 |
| 12266639 | Method of fabricating semiconductor package | Hao-Yi Tsai, Cheng-Chieh Hsieh, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2025-04-01 |
| 12261126 | Semiconductor package | Hsien-Ming Tu, Hao-Yi Tsai, Tin-Hao Kuo | 2025-03-25 |
| 12205860 | Sensor packages | Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng +5 more | 2025-01-21 |
| 12159839 | Semiconductor packages | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tin-Hao Kuo +1 more | 2024-12-03 |
| 12125797 | Package structure with fan-out feature | Shing-Chao Chen, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2024-10-22 |
| 12080653 | Formation method of chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2024-09-03 |
| 11942433 | Integrated circuit package and method | Chen-Hua Yu, Jen-Fu Liu, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang | 2024-03-26 |
| 11935871 | Semiconductor package and method of fabricating the same | Hao-Yi Tsai, Cheng-Chieh Hsieh, Hui-Chun Chiang, Tzu-Sung Huang, Ming Hung Tseng +4 more | 2024-03-19 |
| 11929318 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2024-03-12 |
| 11923318 | Method of manufacturing semiconductor package | Hsien-Ming Tu, Hao-Yi Tsai, Tin-Hao Kuo | 2024-03-05 |
| 11742254 | Sensor package and method | Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng +5 more | 2023-08-29 |
| 11502039 | Semiconductor package and method | Tzu-Sung Huang, Hsiu-Jen Lin, Hao-Yi Tsai, Ming Hung Tseng, Tin-Hao Kuo +1 more | 2022-11-15 |
| 11404381 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Ming-Da Cheng, Ching-Hua Hsieh | 2022-08-02 |
| 11227837 | Integrated circuit package and method | Chen-Hua Yu, Jen-Fu Liu, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang | 2022-01-18 |
| 11158576 | Package structure having redistribution layer structures | Chih-Hao Chang, Hao-Yi Tsai, Tin-Hao Kuo | 2021-10-26 |
| 11133269 | Semiconductor package and manufacturing method thereof | Chun-Ti Lu, Hao-Yi Tsai, Ming Hung Tseng, Yen-Liang Lin, Tzu-Sung Huang | 2021-09-28 |
| 11107772 | Semiconductor package and method of manufacturing semiconductor package | Hsien-Ming Tu, Hao-Yi Tsai, Tin-Hao Kuo | 2021-08-31 |
| 11101192 | Wafer level embedded heat spreader | Wei Sen Chang, Yen-Chang Hu, Ching-Wen Hsiao | 2021-08-24 |
| 11088102 | Bonded structures for package and substrate | Ming-Hong Cha, Chen-Shien Chen, Chen-Cheng Kuo, Hao-Juin Liu, Yao-Chun Chuang +1 more | 2021-08-10 |
| 11004786 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2021-05-11 |
| 10867911 | InFO coil structure and methods of manufacturing same | Chen-Hua Yu, Hao-Yi Tsai, Hung-Yi Kuo, Ming Hung Tseng | 2020-12-15 |