Issued Patents All Time
Showing 1–25 of 31 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12362274 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu +2 more | 2025-07-15 |
| 12334434 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu +2 more | 2025-06-17 |
| 12205860 | Sensor packages | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2025-01-21 |
| 12113022 | Semiconductor package and manufacturing method of semiconductor package | Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu | 2024-10-08 |
| 12051666 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo +2 more | 2024-07-30 |
| 12015017 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo +2 more | 2024-06-18 |
| 11929318 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu +2 more | 2024-03-12 |
| 11855232 | Semiconductor package and forming method thereof | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu +2 more | 2023-12-26 |
| 11847852 | Manufacturing method of fingerprint sensor | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu +1 more | 2023-12-19 |
| 11842993 | Semiconductor device with multiple polarity groups | Yu-Chih Huang, Chih-Hsuan Tai, Ting-Ting Kuo, Chi-Hui Lai, Ban-Li Wu +2 more | 2023-12-12 |
| 11742254 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2023-08-29 |
| 11631658 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ting-Ting Kuo, Chih-Hsuan Tai +5 more | 2023-04-18 |
| 11580767 | Fingerprint sensor | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu +1 more | 2023-02-14 |
| 11527525 | Semiconductor device with multiple polarity groups | Yu-Chih Huang, Chih-Hsuan Tai, Ting-Ting Kuo, Chi-Hui Lai, Ban-Li Wu +2 more | 2022-12-13 |
| 11509278 | Common-mode noise filter | Yang Huang, Chin-Yi Lin | 2022-11-22 |
| 11374136 | Semiconductor package and forming method thereof | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chih-Hao Chang, Chia-Hung Liu +2 more | 2022-06-28 |
| 11355466 | Package structure and manufacturing method of package structure thereof | Po-Yuan Teng, Hao-Yi Tsai, Kuo Lung Pan, Sen-Kuei Hsu, Tin-Hao Kuo +2 more | 2022-06-07 |
| 11164819 | Semiconductor package and manufacturing method thereof | Hao-Yi Tsai, Tin-Hao Kuo, Chia-Hung Liu, Chi-Hui Lai | 2021-11-02 |
| 11158555 | Package structure having sensor die with touch sensing electrode, and method of fabricating the same | Ting-Ting Kuo, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu +1 more | 2021-10-26 |
| 11049850 | Methods of bonding the strip-shaped under bump metallization structures | Chih-Hsuan Tai, Chi-Hui Lai, Ban-Li Wu, Ting-Ting Kuo, Yu-Chih Huang +4 more | 2021-06-29 |
| 11011501 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ting-Ting Kuo +2 more | 2021-05-18 |
| 11004786 | Package structure and method of forming the same | Chih-Hsuan Tai, Hao-Yi Tsai, Tsung-Hsien Chiang, Yu-Chih Huang, Chia-Hung Liu +2 more | 2021-05-11 |
| 10861841 | Semiconductor device with multiple polarity groups | Yu-Chih Huang, Chih-Hsuan Tai, Ting-Ting Kuo, Chi-Hui Lai, Ban-Li Wu +2 more | 2020-12-08 |
| 10840227 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ting-Ting Kuo, Chih-Hsuan Tai +5 more | 2020-11-17 |
| 10832985 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Ting-Ting Kuo, Chih-Hsuan Tai, Ban-Li Wu +5 more | 2020-11-10 |