Issued Patents All Time
Showing 1–25 of 25 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12431446 | Package structure | Chih-Hsuan Tai, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2025-09-30 |
| 12322716 | Heat dissipating features for laser drilling process | Chien-Hung Chen, Cheng-Pu Chiu, Chien-Chen Li, Chien-Li Kuo, Li-Hsien Huang +2 more | 2025-06-03 |
| 12205860 | Sensor packages | Tsung-Hsien Chiang, Yu-Chih Huang, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng +5 more | 2025-01-21 |
| 12068212 | Package structure with through via extending through redistribution layer and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu | 2024-08-20 |
| 12015017 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2024-06-18 |
| 12009322 | Package structure with through-via in molding compound and dielectric layer | Chih-Hsuan Tai, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2024-06-11 |
| 11847852 | Manufacturing method of fingerprint sensor | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu +1 more | 2023-12-19 |
| 11842993 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Chi-Hui Lai, Ban-Li Wu +2 more | 2023-12-12 |
| 11742254 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng +5 more | 2023-08-29 |
| 11631658 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Chih-Hsuan Tai +5 more | 2023-04-18 |
| 11580767 | Fingerprint sensor | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu +1 more | 2023-02-14 |
| 11527525 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Chi-Hui Lai, Ban-Li Wu +2 more | 2022-12-13 |
| 11309225 | Fan-out package structure and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu | 2022-04-19 |
| 11251141 | Package structure | Chih-Hsuan Tai, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2022-02-15 |
| 11158555 | Package structure having sensor die with touch sensing electrode, and method of fabricating the same | Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Chih-Hsuan Tai +1 more | 2021-10-26 |
| 11049850 | Methods of bonding the strip-shaped under bump metallization structures | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Yu-Chih Huang +4 more | 2021-06-29 |
| 11011501 | Package structure, package-on-package structure and method of fabricating the same | Chih-Hsuan Tai, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu, Ban-Li Wu +2 more | 2021-05-18 |
| 10861841 | Semiconductor device with multiple polarity groups | Ying-Cheng Tseng, Yu-Chih Huang, Chih-Hsuan Tai, Chi-Hui Lai, Ban-Li Wu +2 more | 2020-12-08 |
| 10840227 | Under-bump-metallization structure and redistribution layer design for integrated fan-out package with integrated passive device | Yu-Chih Huang, Chi-Hui Lai, Ban-Li Wu, Ying-Cheng Tseng, Chih-Hsuan Tai +5 more | 2020-11-17 |
| 10832985 | Sensor package and method | Tsung-Hsien Chiang, Yu-Chih Huang, Chih-Hsuan Tai, Ban-Li Wu, Ying-Cheng Tseng +5 more | 2020-11-10 |
| 10762319 | Fingerprint sensor and manufacturing method thereof | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu +1 more | 2020-09-01 |
| 10672729 | Package structure and method of forming package structure | Chih-Hsuan Tai, Yu-Chih Huang, Chih-Wei Lin, Hsiu-Jen Lin, Chih-Hua Chen +4 more | 2020-06-02 |
| 10658348 | Semiconductor devices having a plurality of first and second conductive strips | Chih-Hsuan Tai, Chi-Hui Lai, Ying-Cheng Tseng, Ban-Li Wu, Yu-Chih Huang +4 more | 2020-05-19 |
| 10510631 | Fan out package structure and method of manufacturing the same | Chih-Hsuan Tai, Chih-Hua Chen, Hao-Yi Tsai, Yu-Chih Huang, Chia-Hung Liu | 2019-12-17 |
| 10157808 | Package structure and method of forming package structure | Chih-Hsuan Tai, Yu-Chih Huang, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu +1 more | 2018-12-18 |