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Contact features of semiconductor devices |
Tsui-Ling Yen |
2025-09-30 |
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| 12416789 |
Lens assembly |
Hsi-Ling Chang, Guo-Yang Wu, Bo-Yan Chen |
2025-09-16 |
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| 12411808 |
System and method for obtaining instrumentation data |
Rajeev Thakur, Mehran Farimani |
2025-09-09 |
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| 12406125 |
Integrated circuit layout including standard cells and method to form the same |
Ruei-Yau Chen, Wei Wang, Kun-Yuan Wu, Chien-Fu Chen, Chen-Hsien Hsu |
2025-09-02 |
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| 12408428 |
Integrated circuit, method for forming a layout of integrated circuit using standard cells |
Ruei-Yau Chen, Wei Wang, Kun-Yuan Wu, Chien-Fu Chen, Chen-Hsien Hsu |
2025-09-02 |
|
| 12396265 |
Semiconductor structure and manufacturing method thereof |
Chun-Hsien Lin, Ruei-Yau Chen |
2025-08-19 |
|
| 12380066 |
System and method for selecting instrumentation technique |
Rajeev Thakur, Mehran Farimani |
2025-08-05 |
|
| 12356599 |
Static random access memory |
Chih-Kai Hsu |
2025-07-08 |
|
| 12322716 |
Heat dissipating features for laser drilling process |
Cheng-Pu Chiu, Chien-Chen Li, Chien-Li Kuo, Ting-Ting Kuo, Li-Hsien Huang +2 more |
2025-06-03 |
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| 12315768 |
Package assembly including lid with additional stress mitigating feet and methods of making the same |
Yu-Sheng Lin, Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng +3 more |
2025-05-27 |
|
| 12276972 |
Wafer scheduling method and wafer scheduling apparatus for etching equipment |
Jianping Wang, Jinjin Cao |
2025-04-15 |
|
| 12278146 |
Fin field-effect transistor device and method of forming the same |
Che-Yu Lin, Chien-Wei Lee, Wen-Chu Hsiao, Yee-Chia Yeo |
2025-04-15 |
|
| 12255156 |
Semiconductor package with riveting structure between two rings and method for forming the same |
Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng |
2025-03-18 |
|
| 12249539 |
Multigate device structure with engineered cladding and method making the same |
Shu-Wen Shen, Jiun-Ming Kuo, Yuan-Ching Peng, Ji-Xuan YANG, Jheng-Wei LIN |
2025-03-11 |
|
| 12237404 |
Methods for increasing germanium concentration of surfaces of a silicon germanium portion of a Fin and resulting semiconductor devices |
Che-Yu Lin, Wen-Chu Hsiao |
2025-02-25 |
|
| 12218023 |
Semiconductor package and method of forming the same |
Yu-Sheng Lin, Chin-Hua Wang, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng |
2025-02-04 |
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| 12148809 |
Layout pattern of static random access memory |
Chun-Hsien Huang, Yu-Tse Kuo, Shu-Ru Wang, Li-Ping Huang, Chun-Yen Tseng |
2024-11-19 |
$459,000 |
| 12124016 |
Lens assembly |
Hsi-Ling Chang, Ming-Huang Tseng, Guo-Yang Wu, Bo-Yan Chen |
2024-10-22 |
|
| 12119053 |
Method of programming MLC memory device and related MLC memory device |
Chia-Wen Wang, Chia-Hui Huang, Jen Yang Hsueh, Ling-Hsiu Chou, Chih-Yang Hsu |
2024-10-15 |
$840,000 |
| 12119296 |
Encircling a semiconductor device with stacked frames on a substrate |
Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng |
2024-10-15 |
$30,312,000 |
| 12112984 |
Contact features of semiconductor devices |
Tsui-Ling Yen |
2024-10-08 |
$21,494,000 |
| 12087705 |
Package structure with warpage-control element |
Yu-Sheng Lin, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng |
2024-09-10 |
$10,912,000 |
| 12055698 |
Lens assembly |
Hsi-Ling Chang, Chun-Yang Yao, Ming-Huang Tseng |
2024-08-06 |
|
| 12025143 |
Mixed flow fan with enhanced heat dissipation efficiency |
Shun-Chen Chang, Chao-Fu Yang, Chien-Chih Huang |
2024-07-02 |
|
| 12021042 |
Semiconductor package and method of manufacturing the same |
Kai-Ming Ching, Shu-Shen Yeh, Hui Yu, Yu-Min Cheng |
2024-06-25 |
$10,883,000 |
