Issued Patents All Time
Showing 1–25 of 86 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12417970 | Method for forming chip package structure | Chia-Kuei Hsu, Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2025-09-16 |
| 12406898 | Chip package structure with lid | Shu-Shen Yeh, Che-Chia Yang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2025-09-02 |
| 12394752 | Multi-chip device and method of formation | Po-Chen Lai, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2025-08-19 |
| 12387992 | Package and method for forming the same | Yu-Sheng Lin, Chien-Tung Yu, Chia-Hsiang Lin, Shin-Puu Jeng | 2025-08-12 |
| 12387991 | Manufacturing method of semiconductor package | Shu-Shen Yeh, Che-Chia Yang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2025-08-12 |
| 12374561 | Chip package structure with ring dam | Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Shin-Puu Jeng | 2025-07-29 |
| 12374636 | Semiconductor device package with stress reduction design | Shu-Shen Yeh, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2025-07-29 |
| 12368080 | Chip package structure with ring structure | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Kuang-Chun Lee +2 more | 2025-07-22 |
| 12362268 | Package assembly including package substrate with elongated solder resist opening and methods for forming the same | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Zeng | 2025-07-15 |
| 12362256 | Method for forming semiconductor package structure | Po-Chen Lai, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-07-15 |
| 12362197 | Semiconductor die package with ring structure | Yu-Sheng Lin, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng | 2025-07-15 |
| 12347793 | Semiconductor package | Shu-Shen Yeh, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2025-07-01 |
| 12341091 | Semiconductor packages having conductive patterns of redistribution structure having ellipse-like shape | Chia-Kuei Hsu, Ming-Chih Yew, Po-Chen Lai, Po-Yao Lin, Shin-Puu Jeng | 2025-06-24 |
| 12334451 | Semiconductor package including package substrate with dummy via and method of forming the same | Po-Chen Lai, Chun-Wei Chen, Shin-Puu Jeng | 2025-06-17 |
| 12327772 | Semiconductor package including stress-reduction structures and methods of forming the same | Shu-Shen Yeh, Yu-Sheng Lin, Ming-Chih Yew, Po-Yao Lin, Shin-Puu Jeng | 2025-06-10 |
| 12322704 | Package structure with underfill | Yu-Sheng Lin, Shin-Puu Jeng, Po-Yao Lin, Shu-Shen Yeh, Che-Chia Yang | 2025-06-03 |
| 12322666 | Package assembly lid and methods for forming the same | Yu-Sheng Lin, Shu-Shen Yeh, Chien-Shen Chen, Po-Yao Lin, Shin-Puu Jeng +3 more | 2025-06-03 |
| 12315768 | Package assembly including lid with additional stress mitigating feet and methods of making the same | Yu-Sheng Lin, Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Chien-Hung Chen +3 more | 2025-05-27 |
| 12308346 | Semiconductor die with tapered sidewall in package | Shin-Puu Jeng, Po-Yao Lin, Po-Chen Lai, Shu-Shen Yeh, Ming-Chih Yew +1 more | 2025-05-20 |
| 12300632 | Chip package with lid | Shu-Shen Yeh, Kuang-Chun Lee, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2025-05-13 |
| 12283553 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Kuang-Chun Lee, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2025-04-22 |
| 12278156 | Semiconductor package | Po-Yao Lin, Feng-Cheng Hsu, Shin-Puu Jeng, Wen-Yi Lin, Shu-Shen Yeh | 2025-04-15 |
| 12255118 | Package structure and method of fabricating the same | Yu-Sheng Lin, Po-Yao Lin, Shu-Shen Yeh, Shin-Puu Jeng | 2025-03-18 |
| 12255119 | Package assembly including liquid alloy thermal interface material (TIM) and seal ring around the liquid alloy TIM and methods of forming the same | Yu-Sheng Lin, Po-Yao Lin, Ming-Chih Yew, Shin-Puu Jeng | 2025-03-18 |
| 12243800 | Package structure with lid and method for forming the same | Shin-Puu Jeng, Po-Yao Lin, Feng-Cheng Hsu, Shuo-Mao Chen | 2025-03-04 |