Issued Patents All Time
Showing 1–21 of 21 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12368080 | Chip package structure with ring structure | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Che-Chia Yang +2 more | 2025-07-22 |
| 12327782 | Systems for semiconductor package mounting with improved co-planarity | Wen-Yi Lin, Chien-Chen Li, Chen-Shien Chen | 2025-06-10 |
| 12300632 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2025-05-13 |
| 12283553 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2025-04-22 |
| 12119276 | Package structure with protective lid | Wen-Yi Lin, Chien-Chen Li, Chen-Shien Chen | 2024-10-15 |
| 11978720 | Semiconductor device package and methods of manufacture | Kai Jun Zhan, Chin-Fu Kao, Ming-Da Cheng, Chen-Shien Chen | 2024-05-07 |
| 11855009 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2023-12-26 |
| 11764118 | Structure and formation method of chip package with protective lid | Wen-Yi Lin, Chien-Chen Li, Chen-Shien Chen | 2023-09-19 |
| 11728233 | Chip package structure with ring structure and method for forming the same | Shu-Shen Yeh, Po-Yao Lin, Shin-Puu Jeng, Po-Chen Lai, Che-Chia Yang +2 more | 2023-08-15 |
| 11694974 | Semiconductor die with warpage release layer structure in package and fabricating method thereof | Chin-Hua Wang, Shu-Shen Yeh, Tsung-Yen Lee, Po-Yao Lin, Shin-Puu Jeng | 2023-07-04 |
| 11508710 | Method of forming semiconductor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng +1 more | 2022-11-22 |
| 11410939 | Chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2022-08-09 |
| 10797006 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2020-10-06 |
| 10790164 | Method for forming package structure | Wen-Yi Lin, Che-Chia Yang, Yu-Sheng Lin, Po-Yao Lin, Shin-Puu Jeng | 2020-09-29 |
| 10714463 | Method of forming semicondcutor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng +1 more | 2020-07-14 |
| 10504880 | Method of forming semicondcutor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng +1 more | 2019-12-10 |
| 10276551 | Semiconductor device package and method of forming semiconductor device package | Po-Yao Lin, Cheng-Yi Hong, Feng-Cheng Hsu, Shuo-Mao Chen, Shin-Puu Jeng +1 more | 2019-04-30 |
| 10163816 | Structure and formation method of chip package with lid | Shu-Shen Yeh, Chin-Hua Wang, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2018-12-25 |
| 9870975 | Chip package with thermal dissipation structure and method for forming the same | Chin-Hua Wang, Po-Yao Lin, Shu-Shen Yeh, Shin-Puu Jeng, Shyue-Ter Leu +2 more | 2018-01-16 |
| 9748156 | Semiconductor package assembly, semiconductor package and forming method thereof | Shu-Shen Yeh, Cheng-Lin Huang, Chin-Hua Wang, Wen-Yi Lin, Ming-Chih Yew +4 more | 2017-08-29 |
| 9653391 | Semiconductor packaging structure and manufacturing method thereof | Ming-Chih Yew, Po-Yao Lin, Shyue-Ter Leu, Shin-Puu Jeng | 2017-05-16 |