Issued Patents All Time
Showing 1–25 of 109 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12381114 | Package structure with fan-out feature | Ling Li, Jung-Hua Chang | 2025-08-05 |
| 12275135 | Humanoid finger mechanism | Hongliang Hua, Shihong Wu, Xiaofeng Wu, Yongjiang Chen, Xiaojun Wang | 2025-04-15 |
| 12255173 | Chip package structure | Ling Li, Jung-Hua Chang | 2025-03-18 |
| 12183709 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2024-12-31 |
| 12087618 | Method for forming semiconductor die having edge with multiple gradients | Yu-Sheng Tang, Fu-Chen Chang, Wen-Ming Chen, Chun-Yen Lo, Kuo-Chio Liu | 2024-09-10 |
| 11948876 | Package structure with through vias | Ling Li, Jung-Hua Chang | 2024-04-02 |
| 11854826 | Metal oxide layered structure and methods of forming the same | Jing-Cheng Lin | 2023-12-26 |
| 11855039 | Chip package structure | Ling Li, Jung-Hua Chang | 2023-12-26 |
| 11848302 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2023-12-19 |
| 11784091 | Structure and formation method of chip package with fan-out feature | Ling Li, Jung-Hua Chang | 2023-10-10 |
| 11569159 | Structure and formation method of chip package with through vias | Ling Li, Jung-Hua Chang | 2023-01-31 |
| 11545463 | Chip package structure with ring-like structure | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2023-01-03 |
| 11532577 | Fan-out package and methods of forming thereof | Wan-Ting Shih, Nai-Wei Liu, Jing-Cheng Lin | 2022-12-20 |
| 11527504 | Conductive external connector structure and method of forming | Meng-Fu Shih, Chun-Yen Lo, Wen-Ming Chen, Chien-Ming Huang, Yuan-Fu Liu +8 more | 2022-12-13 |
| 11456276 | Chip package structure | Ling Li, Jung-Hua Chang | 2022-09-27 |
| 11443957 | Metal oxide layered structure and methods of forming the same | Jing-Cheng Lin | 2022-09-13 |
| 11367658 | Semiconductor die singulation and structures formed thereby | Fu-Chen Chang, Wen-Ming Chen | 2022-06-21 |
| 11355406 | Non-vertical through-via in package | Jung-Hua Chang, Jy-Jie Gau, Jing-Cheng Lin | 2022-06-07 |
| 11336106 | Charging system with low power consumption | Hung-Hsuan Cheng, Shih-Chieh Chen, Chun Luo, Yi Li, Liang Li | 2022-05-17 |
| 11329031 | Structure and formation method for chip package | Jui-Pin Hung, Hsien-Wen Liu, Shin-Puu Jeng | 2022-05-10 |
| 11211318 | Bump layout for coplanarity improvement | Ling Li, Min-Tar Liu, Fu-Kang Chiao, Matt Chou, Chun-Yen Lo +3 more | 2021-12-28 |
| 11088108 | Chip package structure including ring-like structure and method for forming the same | Sheng-Yao Yang, Ling Li, Yu-Jui Wu, Chien-Chen Li, Lieh-Chuan Chen +2 more | 2021-08-10 |
| 11004728 | Semiconductor die having edge with multiple gradients and method for forming the same | Yu-Sheng Tang, Fu-Chen Chang, Wen-Ming Chen, Chun-Yen Lo, Kuo-Chio Liu | 2021-05-11 |
| 10861761 | Semiconductor packaged wafer and method for forming the same | Fu-Chen Chang, Wen-Ming Chen, Shih-Yen Chen, Ruei-Yi Tsai, Pin-Yi Hsin | 2020-12-08 |
| 10770427 | Chip package structure and method for forming the same | Ling Li, Jung-Hua Chang | 2020-09-08 |