Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11355406 | Non-vertical through-via in package | Cheng-Lin Huang, Jung-Hua Chang, Jing-Cheng Lin | 2022-06-07 |
| 10699981 | Non-vertical through-via in package | Cheng-Lin Huang, Jung-Hua Chang, Jing-Cheng Lin | 2020-06-30 |
| 10115647 | Non-vertical through-via in package | Cheng-Lin Huang, Jung-Hua Chang, Jing-Cheng Lin | 2018-10-30 |
| 9343419 | Bump structures for semiconductor package | Chen-Hua Yu, Meng-Liang Lin, Cheng-Lin Huang, Jing-Cheng Lin, Kuo-Ching Hsu | 2016-05-17 |
| 7005236 | Maintaining photoresist planarity at hole edges | Su-Jen Cheng, Bor-Ping Jang, Chun-Chieh Wang | 2006-02-28 |