Issued Patents All Time
Showing 1–25 of 42 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11721555 | Method and system for thinning wafer thereof | Chien Ling Hwang, Hsin-Hung Liao, Chung-Shi Liu | 2023-08-08 |
| 11390000 | Wafer level transfer molding and apparatus for performing the same | Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2022-07-19 |
| 11233032 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Hsiao-Chung Liang, Chung-Shi Liu | 2022-01-25 |
| 11139177 | Method of fabricating semiconductor package structure | Chien Ling Hwang, Chung-Shi Liu, Hsin-Hung Liao, Ying-Jui Huang | 2021-10-05 |
| 11094561 | Semiconductor package structure | Chien Ling Hwang, Chung-Shi Liu, Hsin-Hung Liao, Ying-Jui Huang | 2021-08-17 |
| 11024618 | Wafer-level underfill and over-molding | Chung-Shi Liu, Chien Ling Hwang, Yeong-Jyh Lin | 2021-06-01 |
| 10985135 | Methods for controlling warpage in packaging | Chien Ling Hwang, Jen-Chun Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2021-04-20 |
| 10804234 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Chien Ling Hwang, Yeong-Jyh Lin, Hsiao-Chung Liang | 2020-10-13 |
| 10770331 | Semiconductor wafer device and manufacturing method thereof | Chien Ling Hwang, Hsin-Hung Liao, Yeong-Jyh Lin | 2020-09-08 |
| 10727074 | Method and system for thinning wafer thereof | Chien Ling Hwang, Hsin-Hung Liao, Chung-Shi Liu | 2020-07-28 |
| 10679866 | Interconnect structure for semiconductor package and method of fabricating the interconnect structure | Chien Ling Hwang, Chung-Shi Liu, Hsin-Hung Liao, Ying-Jui Huang | 2020-06-09 |
| 10513070 | Wafer level transfer molding and apparatus for performing the same | Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2019-12-24 |
| 10510712 | Methods for controlling warpage in packaging | Chien Ling Hwang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-17 |
| 10504870 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Hsiao-Chung Liang, Chung-Shi Liu | 2019-12-10 |
| 10276531 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Chien Ling Hwang, Yeong-Jyh Lin, Hsiao-Chung Liang | 2019-04-30 |
| 10157881 | Methods for controlling warpage in packaging | Chien Ling Hwang, Hsin-Hung Liao, Yeong-Jyh Lin, Hsiao-Chung Liang, Chung-Shi Liu | 2018-12-18 |
| 10134703 | Package on-package process for applying molding compound | Meng-Tse Chen, Wei-Hung Lin, Sheng-Yu Wu, Ming-Da Cheng, Chung-Shi Liu +6 more | 2018-11-20 |
| 10056285 | Semiconductor wafer device and manufacturing method thereof | Chien Ling Hwang, Hsin-Hung Liao, Yeong-Jyh Lin | 2018-08-21 |
| 10020211 | Wafer-level molding chase design | Chen-Hua Yu, Chung-Shi Liu, Hui-Min Huang, Chih-Fan Huang, Ming-Da Cheng +2 more | 2018-07-10 |
| 9893044 | Wafer-level underfill and over-molding | Chung-Shi Liu, Chien Ling Hwang, Yeong-Jyh Lin | 2018-02-13 |
| 9812346 | Semiconductor wafer device and manufacturing method thereof | Chien Ling Hwang, Hsin-Hung Liao, Yeong-Jyh Lin | 2017-11-07 |
| 9802349 | Wafer level transfer molding and apparatus for performing the same | Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Meng-Tse Chen, Ming-Da Cheng +1 more | 2017-10-31 |
| 9768142 | Mechanisms for forming bonding structures | Yeong-Jyh Lin, Hsin-Hung Liao, Chien Ling Hwang, Hsiao-Chung Liang, Chung-Shi Liu | 2017-09-19 |
| 9700950 | Innovative multi-purpose dipping plate | Lin-Wei Wang, Ying-Jui Huang, Yi-Li Hsiao, Chien Ling Hwang, Chung-Shi Liu | 2017-07-11 |
| 9659891 | Semiconductor device having a boundary structure, a package on package structure, and a method of making | Chien Ling Hwang, Yeong-Jyh Lin, Hsiao-Chung Liang | 2017-05-23 |