Issued Patents All Time
Showing 1–25 of 94 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12204717 | Systems and methods for flex circuit connections in touch screens | Arnoldus Alvin Barlian, Bayu A Thedjoisworo, Boris Russ, Ziyang Zhang, Nathan K. Gupta | 2025-01-21 |
| 12119238 | Semiconductor bonding structures and methods | Hsiu-Jen Lin, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu | 2024-10-15 |
| 12057415 | Semiconductor device having antenna and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Sheng-Hsiang Chiu | 2024-08-06 |
| 12009345 | 3D package structure and methods of forming same | Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2024-06-11 |
| 11955460 | Advanced info POP and method of forming thereof | Yi-Da Tsai, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng +2 more | 2024-04-09 |
| 11776945 | Package-on-package structure including a thermal isolation material | Kuei-Wei Huang, Tsai-Tsung Tsai, Ai-Tee Ang, Ming-Da Cheng, Chung-Shi Liu | 2023-10-03 |
| 11749535 | Semiconductor bonding structures and methods | Hsiu-Jen Lin, Wei-Hung Lin, Kuei-Wei Huang, Ming-Da Cheng, Chung-Shi Liu | 2023-09-05 |
| 11705409 | Semiconductor device having antenna on chip package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Sheng-Hsiang Chiu | 2023-07-18 |
| 11545465 | 3D package structure and methods of forming same | Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2023-01-03 |
| 11390000 | Wafer level transfer molding and apparatus for performing the same | Bor-Ping Jang, Yeong-Jyh Lin, Chien Ling Hwang, Chung-Shi Liu, Ming-Da Cheng +1 more | 2022-07-19 |
| 11264342 | Package on package structure and method for forming the same | Chen-Hua Yu, Chung-Shi Liu, Ming-Da Cheng, Mirng-Ji Lii, Wei-Hung Lin | 2022-03-01 |
| 11177237 | Manufacturing method of semiconductor package | Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin | 2021-11-16 |
| 11150458 | Multi-mode imaging optical system | Chao-Wei Li, Meng LV, Feng Chen, Yaohua Du, Zhi Cheng +1 more | 2021-10-19 |
| 11133285 | Package-on-package structure having polymer-based material for warpage control | Yu-Chih Liu, Hui-Min Huang, Wei-Hung Lin, Jing Ruei Lu, Ming-Da Cheng +1 more | 2021-09-28 |
| 11121104 | Method for manufacturing interconnect structure | Hsiu-Jen Lin, Chih-Wei Lin, Ming-Da Cheng, Chih-Hang Tung, Chung-Shi Liu | 2021-09-14 |
| 10950556 | EMI shielding structure in InFO package | Kai-Chiang Wu, Chen-Hua Yu, Ching-Feng Yang | 2021-03-16 |
| 10879203 | Stud bump structure for semiconductor package assemblies | Hsiu-Jen Lin, Chih-Wei Lin, Cheng-Ting Chen, Ming-Da Cheng, Chung-Shi Liu | 2020-12-29 |
| 10867960 | Device package including molding compound having non-planar top surface around a die and method of forming same | Chen-Hua Yu, Ming-Da Cheng, Chung-Shi Liu | 2020-12-15 |
| 10861827 | 3D package structure and methods of forming same | Chung-Shi Liu, Chih-Wei Lin, Hui-Min Huang, Hsuan-Ting Kuo, Ming-Da Cheng | 2020-12-08 |
| 10840111 | Chip package with fan-out structure | Shing-Chao Chen, Chih-Wei Lin, Hui-Min Huang, Ming-Da Cheng, Kuo Lung Pan +3 more | 2020-11-17 |
| 10832999 | Packaging methods for semiconductor devices comprising forming trenches in separation regions between adjacent packaging substrates | Kuei-Wei Huang, Wei-Hung Lin, Chih-Wei Lin, Chun-Cheng Lin, Ming-Da Cheng +1 more | 2020-11-10 |
| 10818614 | Package structure | Ching-Hua Hsieh, Chung-Shi Liu, Chih-Wei Lin, Hao-Cheng Hou, Jung Wei Cheng | 2020-10-27 |
| 10797025 | Advanced INFO POP and method of forming thereof | Yi-Da Tsai, Sheng-Feng Weng, Sheng-Hsiang Chiu, Wei-Hung Lin, Ming-Da Cheng +2 more | 2020-10-06 |
| 10741508 | Semiconductor device having antenna and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Han-Ping Pu, Sheng-Hsiang Chiu | 2020-08-11 |
| 10600709 | Bump-on-trace packaging structure and method for forming the same | Wei-Hung Lin, Chih-Wei Lin, Kuei-Wei Huang, Hui-Min Huang, Ming-Da Cheng +1 more | 2020-03-24 |