Issued Patents All Time
Showing 1–25 of 132 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12406965 | Package | Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-09-02 |
| 12355008 | Methods of fabricating package structure | Ming-Fa Chen, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-07-08 |
| 12288752 | Semiconductor packages | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-04-29 |
| 12272674 | Stacking structure, package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-04-08 |
| 12266847 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2025-04-01 |
| 12266619 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Chung-Shi Liu, Shou-Zen Chang | 2025-04-01 |
| 12224265 | Three-dimensional stacking structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2025-02-11 |
| 12154897 | Package structures | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-11-26 |
| 12154875 | Package and method of fabricating the same | Ming-Fa Chen, Tzuan-Horng Liu, Jen-Li Hu | 2024-11-26 |
| 12148664 | Semiconductor device and method having a through substrate via and an interconnect structure | Ming-Fa Chen, Tzuan-Horng Liu | 2024-11-19 |
| 12125819 | Die on die bonding structure | Ming-Fa Chen, Sung-Feng Yeh | 2024-10-22 |
| 12125821 | Package having multiple chips integrated therein and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-10-22 |
| 12119328 | Methods of fabricating the same die stack structure and semiconductor structure | Ming-Fa Chen, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-10-15 |
| 12094852 | Package structure and method of manufacturing the same | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-09-17 |
| 12057439 | Integrated circuit packages | Ming-Fa Chen, Tzuan-Horng Liu, Sung-Feng Yeh, Nien-Fang Wu | 2024-08-06 |
| 12057437 | Package structure, chip structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-08-06 |
| 12057415 | Semiconductor device having antenna and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Han-Ping Pu, Meng-Tse Chen, Sheng-Hsiang Chiu | 2024-08-06 |
| 12051673 | Package having multiple chips integrated therein and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-07-30 |
| 12046579 | Package having bonding layers | Ming-Fa Chen, Hsien-Wei Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-07-23 |
| 12015013 | Die stack structure, semiconductor structure and method of fabricating the same | Ming-Fa Chen, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-06-18 |
| 12009575 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chung-Shi Liu, Shou-Zen Chang | 2024-06-11 |
| 11916012 | Manufacturing method of semiconductor structure | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2024-02-27 |
| 11894299 | Conductive traces in semiconductor devices and methods of forming same | Chen-Hua Yu, Han-Ping Pu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu | 2024-02-06 |
| 11894309 | System on integrated chips (SoIC) and semiconductor structures with integrated SoIC | Chen-Hua Yu, Tzuan-Horng Liu, Ming-Fa Chen, Sung-Feng Yeh | 2024-02-06 |
| 11855333 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2023-12-26 |