Issued Patents All Time
Showing 26–50 of 132 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11823989 | Multi-liner TSV structure and method forming same | Ming-Fa Chen, Chin-Shyh Wang | 2023-11-21 |
| 11810897 | Package structure and method of fabricating the same | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2023-11-07 |
| 11784163 | Stacking structure, package structure and method of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2023-10-10 |
| 11749626 | Integrated devices in semiconductor packages and methods of forming same | Chen-Hua Yu, Kai-Chiang Wu, Chung-Shi Liu, Shou-Zen Chang | 2023-09-05 |
| 11742297 | Semiconductor packages | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2023-08-29 |
| 11715723 | Wafer on wafer bonding structure | Ming-Fa Chen, Sung-Feng Yeh | 2023-08-01 |
| 11705411 | Chip package with antenna element | Yung-Ping Chiang, Yi-Che Chiang, Nien-Fang Wu, Min-Chien Hsiao, Shou-Zen Chang +2 more | 2023-07-18 |
| 11705409 | Semiconductor device having antenna on chip package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Han-Ping Pu, Meng-Tse Chen, Sheng-Hsiang Chiu | 2023-07-18 |
| 11658392 | Package structure | Nan-Chin Chuang, Chen-Hua Yu, Chung-Shi Liu, Shou-Zen Chang | 2023-05-23 |
| 11658069 | Method for manufacturing a semiconductor device having an interconnect structure over a substrate | Ming-Fa Chen, Tzuan-Horng Liu | 2023-05-23 |
| 11587894 | Package and method of fabricating the same | Ming-Fa Chen, Tzuan-Horng Liu, Jen-Li Hu | 2023-02-21 |
| 11562983 | Package having multiple chips integrated therein and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2023-01-24 |
| 11552074 | Package structures and methods of fabricating the same | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2023-01-10 |
| 11515618 | Semiconductor packages and manufacturing methods thereof | Yung-Ping Chiang, Shou-Zen Chang, Albert Wan, Yu-Sheng Hsieh | 2022-11-29 |
| 11502062 | Integrated circuit package and method | Ming-Fa Chen, Tzuan-Horng Liu, Sung-Feng Yeh, Nien-Fang Wu | 2022-11-15 |
| 11417629 | Three-dimensional stacking structure and manufacturing method thereof | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-08-16 |
| 11335655 | Package structure and manufacturing method thereof | Albert Wan, Shou-Zen Chang, Nan-Chin Chuang | 2022-05-17 |
| 11322477 | Package structure and method of fabricating the same | Ming-Fa Chen, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-05-03 |
| 11282810 | Integrated fan-out package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Han-Ping Pu +5 more | 2022-03-22 |
| 11264362 | Semiconductor structure and method of fabricating the same | Ming-Fa Chen, Min-Chien Hsiao, Nien-Fang Wu, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-03-01 |
| 11244896 | Package structure and manufacturing method thereof | Min-Chien Hsiao, Chuei-Tang Wang, Han-Ping Pu, Chieh-Yen Chen | 2022-02-08 |
| 11245176 | Package structure, electronic device and method of fabricating package structure | Min-Chien Hsiao, Chen-Hua Yu, Chung-Shi Liu, Shou-Zen Chang | 2022-02-08 |
| 11233035 | Package structure and method of manufacturing the same | Ming-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu | 2022-01-25 |
| 11177355 | Semiconductor structure and manufacturing method thereof | Chen-Hua Yu, Mirng-Ji Lii, Hung-Yi Kuo, Hao-Yi Tsai, Tsung-Yuan Yu +1 more | 2021-11-16 |
| 11164848 | Semiconductor structure and method manufacturing the same | Ming-Fa Chen, Min-Chien Hsiao, Sung-Feng Yeh, Tzuan-Horng Liu, Chuan-An Cheng | 2021-11-02 |