Issued Patents All Time
Showing 1–25 of 136 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400936 | Stacked memory cube with integrated thermal path for enhanced heat dissipation | Lipu Kris Chuang, Chung-Shi Liu, Hsin-Yu Pan, Ming-Kai Liu, Ting-Chu Ko | 2025-08-26 |
| 12205888 | Semiconductor packages and methods of forming the same | Ching-Yu Huang, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2025-01-21 |
| 12165985 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu, Ting-Chu Ko | 2024-12-10 |
| 12148735 | Memory device and manufacturing method thereof | Ching-Yu Huang, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2024-11-19 |
| 12132247 | Semiconductor package and manufacturing method thereof | Yen-Ping Wang, Chun-Lin Lu, Kai-Chiang Wu, Chung-Yi Hsu | 2024-10-29 |
| 12119303 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu, Kai-Chiang Wu | 2024-10-15 |
| 12062622 | Integrated fan-out packaging | Hsiao-Wen Lee | 2024-08-13 |
| 12057415 | Semiconductor device having antenna and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Meng-Tse Chen, Sheng-Hsiang Chiu | 2024-08-06 |
| 11929319 | Integrated fan-out packages and methods of forming the same | Ching-Yu Huang, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2024-03-12 |
| 11894299 | Conductive traces in semiconductor devices and methods of forming same | Chao-Wen Shih, Chen-Hua Yu, Hsin-Yu Pan, Hao-Yi Tsai, Sen-Kuei Hsu | 2024-02-06 |
| 11824005 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu, Kai-Chiang Wu | 2023-11-21 |
| 11705409 | Semiconductor device having antenna on chip package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chao-Wen Shih, Meng-Tse Chen, Sheng-Hsiang Chiu | 2023-07-18 |
| 11569562 | Semiconductor package and manufacturing method thereof | Yen-Ping Wang, Chun-Lin Lu, Kai-Chiang Wu, Chung-Yi Hsu | 2023-01-31 |
| 11551999 | Memory device and manufacturing method thereof | Lipu Kris Chuang, Chung-Shi Liu, Hsin-Yu Pan, Ming-Kai Liu, Ting-Chu Ko | 2023-01-10 |
| 11488908 | Semiconductor device and method | Chen-Hua Yu, Hui-Jung Tsai, Hung-Jui Kuo, Chung-Shi Liu, Ting-Chu Ko | 2022-11-01 |
| 11437327 | Integrated fan-out packaging | Hsiao-Wen Lee | 2022-09-06 |
| 11424197 | Package, package structure with redistributing circuits and antenna elements and method of manufacturing the same | Chuei-Tang Wang, Chung-Hao Tsai, Chen-Hua Yu, Chun-Lin Lu, Kai-Chiang Wu | 2022-08-23 |
| 11417616 | Package structure and manufacturing method thereof | Kai-Chiang Wu, Yen-Ping Wang | 2022-08-16 |
| 11342269 | Package structure with reinforcement structures in a redistribution circuit structure and manufacturing method thereof | Chen-Hua Yu, Chun-Lin Lu, Kai-Chiang Wu | 2022-05-24 |
| 11335666 | Memory device and manufacturing method thereof | Ching-Yu Huang, Ming-Kai Liu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2022-05-17 |
| 11282810 | Integrated fan-out package and manufacturing method thereof | Albert Wan, Ching-Hua Hsieh, Chung-Hao Tsai, Chuei-Tang Wang, Chao-Wen Shih +5 more | 2022-03-22 |
| 11282817 | Semiconductor device package including embedded conductive elements | Yu-Feng Chen, Chun-Hung Lin, Ming-Da Cheng, Kai-Chiang Wu | 2022-03-22 |
| 11244896 | Package structure and manufacturing method thereof | Min-Chien Hsiao, Chuei-Tang Wang, Chao-Wen Shih, Chieh-Yen Chen | 2022-02-08 |
| 11189603 | Semiconductor packages and methods of forming same | Chen-Hua Yu, Der-Chyang Yeh | 2021-11-30 |
| 11145595 | Integrated fan-out package with antenna components and manufacturing method thereof | Chun-Lin Lu, Kai-Chiang Wu, Nan-Chin Chuang | 2021-10-12 |