Issued Patents All Time
Showing 1–25 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12400936 | Stacked memory cube with integrated thermal path for enhanced heat dissipation | Lipu Kris Chuang, Chung-Shi Liu, Han-Ping Pu, Hsin-Yu Pan, Ting-Chu Ko | 2025-08-26 |
| 12205888 | Semiconductor packages and methods of forming the same | Ching-Yu Huang, Han-Ping Pu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2025-01-21 |
| 12148735 | Memory device and manufacturing method thereof | Ching-Yu Huang, Han-Ping Pu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2024-11-19 |
| 11929319 | Integrated fan-out packages and methods of forming the same | Ching-Yu Huang, Han-Ping Pu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2024-03-12 |
| 11894330 | Methods of manufacturing a semiconductor device including a joint adjacent to a post | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2024-02-06 |
| 11551999 | Memory device and manufacturing method thereof | Lipu Kris Chuang, Chung-Shi Liu, Han-Ping Pu, Hsin-Yu Pan, Ting-Chu Ko | 2023-01-10 |
| 11335666 | Memory device and manufacturing method thereof | Ching-Yu Huang, Han-Ping Pu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2022-05-17 |
| RE49046 | Methods and apparatus for package on package devices | Kai-Chiang Wu, Hsien-Wei Chen, Shih-Wei Liang | 2022-04-19 |
| 11211339 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2021-12-28 |
| 11127708 | Package structure and method of manufacturing the same | Han-Ping Pu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh | 2021-09-21 |
| 11101238 | Surface mounting semiconductor components | Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2021-08-24 |
| 11075159 | Integrated fan-out packages and methods of forming the same | Ching-Yu Huang, Han-Ping Pu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang +1 more | 2021-07-27 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2021-04-06 |
| 10964595 | Method for singulating packaged integrated circuits and resulting structures | Yen-Ping Wang, Kai-Chiang Wu | 2021-03-30 |
| 10879170 | Semiconductor package and manufacturing method thereof | Yung-Ping Chiang, Chung-Shi Liu, Han-Ping Pu, Ting-Chu Ko, Chang-Wen Huang +2 more | 2020-12-29 |
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2020-12-15 |
| 10510681 | Semiconductor device | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2019-12-17 |
| 10504865 | Package structure and method of manufacturing the same | Han-Ping Pu, Ting-Chu Ko, Yung-Ping Chiang, Chang-Wen Huang, Yu-Sheng Hsieh | 2019-12-10 |
| 10312209 | Manufacturing method of semiconductor package | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Shih-Wei Liang, Yen-Ping Wang | 2019-06-04 |
| 10304790 | Method of fabricating an integrated fan-out package | Shou-Zen Chang, Chung-Hao Tsai, Chuei-Tang Wang, Kai-Chiang Wu | 2019-05-28 |
| 10269640 | Method for singulating packaged integrated circuits and resulting structures | Yen-Ping Wang, Kai-Chiang Wu | 2019-04-23 |
| 10269588 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Chia-Chun Miao +1 more | 2019-04-23 |
| 10163824 | Integrated fan-out package and method of fabricating the same | Shou-Zen Chang, Chung-Hao Tsai, Chuei-Tang Wang, Kai-Chiang Wu | 2018-12-25 |
| 10163846 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2018-12-25 |
| 10157900 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Hsin-Yu Pan, Kai-Chiang Wu, Ching-Feng Yang, Chia-Chun Miao | 2018-12-18 |