Issued Patents All Time
Showing 26–50 of 50 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10043761 | Semiconductor device and manufacturing method thereof | Chuei-Tang Wang, Vincent Chen, Tzu-Chun Tang, Chen-Hua Yu, Ching-Feng Yang +5 more | 2018-08-07 |
| 10037959 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Shih-Wei Liang, Yen-Ping Wang, Kai-Chiang Wu | 2018-07-31 |
| 9953942 | Semiconductor packaging and manufacturing method thereof | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Shih-Wei Liang, Yen-Ping Wang | 2018-04-24 |
| 9941240 | Semiconductor chip scale package and manufacturing method thereof | Chun-Lin Lu, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2018-04-10 |
| 9875913 | Method for singulating packaged integrated circuits and resulting structures | Yen-Ping Wang, Kai-Chiang Wu | 2018-01-23 |
| 9806045 | Interconnection structure including a metal post encapsulated by solder joint having a concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2017-10-31 |
| 9653417 | Method for singulating packaged integrated circuits and resulting structures | Yen-Ping Wang, Kai-Chiang Wu | 2017-05-16 |
| 9627325 | Package alignment structure and method of forming same | Chia-Chun Miao, Kai-Chiang Wu, Shih-Wei Liang, Ching-Feng Yang, Yen-Ping Wang +1 more | 2017-04-18 |
| 9559071 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Shih-Wei Liang, Ching-Feng Yang +2 more | 2017-01-31 |
| 9543263 | Semiconductor packaging and manufacturing method thereof | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Shih-Wei Liang, Yen-Ping Wang | 2017-01-10 |
| 9543373 | Semiconductor structure and manufacturing method thereof | Shih-Wei Liang, Hsin-Yu Pan, Kai-Chiang Wu, Ching-Feng Yang, Chia-Chun Miao | 2017-01-10 |
| 9484308 | Semiconductor device | Chao-Wen Shih, Yung-Ping Chiang | 2016-11-01 |
| 9472523 | Semiconductor structure and manufacturing method thereof | Chia-Chun Miao, Shih-Wei Liang, Yen-Ping Wang, Kai-Chiang Wu | 2016-10-18 |
| 9460989 | Interposer having a defined through via pattern | Shih-Wei Liang, Kai-Chiang Wu, Chia-Chun Miao, Chun-Lin Lu | 2016-10-04 |
| 9412661 | Method for forming package-on-package structure | Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang | 2016-08-09 |
| 9391012 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Hsien-Wei Chen, Yu-Feng Chen, Chun-Hung Lin, Chun-Lin Lu | 2016-07-12 |
| 9373599 | Methods and apparatus for package on package devices | Kai-Chiang Wu, Hsien-Wei Chen, Shih-Wei Liang | 2016-06-21 |
| 9355924 | Integrated circuit underfill scheme | Shih-Wei Liang, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Chia-Chun Miao +1 more | 2016-05-31 |
| 9331023 | Device packaging | Yu-Peng Tsai, Kai-Chiang Wu, Wei-Hung Lin, Hao-Yi Tsai, Mirng-Ji Lii | 2016-05-03 |
| 9064873 | Singulated semiconductor structure | Chia-Chun Miao, Shih-Wei Liang, Kai-Chiang Wu, Yen-Ping Wang | 2015-06-23 |
| 8994176 | Methods and apparatus for package with interposers | Kai-Chiang Wu, Hsien-Wei Chen, Yu-Feng Chen, Chun-Hung Lin, Chun-Lin Lu | 2015-03-31 |
| 8941202 | Image sensor devices and methods for manufacturing the same | Tzu-Wei Huang, Jui-Hung Chang, Chia-Hui Huang, Teng-Sheng Chen | 2015-01-27 |
| 8901730 | Methods and apparatus for package on package devices | Shih-Wei Liang, Hsien-Wei Chen, Kai-Chiang Wu | 2014-12-02 |
| 8664768 | Interposer having a defined through via pattern | Shih-Wei Liang, Kai-Chiang Wu, Chia-Chun Miao, Chun-Lin Lu | 2014-03-04 |
| 8557626 | Image sensor devices and methods for manufacturing the same | Tzu-Wei Huang, Jui-Hung Chang, Chia-Hui Huang, Teng-Sheng Chen | 2013-10-15 |