Issued Patents All Time
Showing 1–25 of 81 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12412852 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2025-09-09 |
| 12322696 | Dual-mode wireless charging device | Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng, Hsien-Ming Tu | 2025-06-03 |
| 12322670 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Ching-Feng Yang | 2025-06-03 |
| 12218035 | Barrier structures between external electrical connectors | Chia-Chun Miao, Kai-Chiang Wu | 2025-02-04 |
| 12062635 | Semiconductor device packages including conductors electrically connecting stacked semiconductor devices by extending along surfaces of the semiconductor devices | Po Chih Yang, Yu-Jen Chen, Po Chen Kuo | 2024-08-13 |
| 11894330 | Methods of manufacturing a semiconductor device including a joint adjacent to a post | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Ching-Feng Yang +2 more | 2024-02-06 |
| 11735518 | Dual-mode wireless charging device | Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng, Hsien-Ming Tu | 2023-08-22 |
| 11398440 | Polymer layers embedded with metal pads for heat dissipation | Hao-Hsiang Chuang, Ching-Feng Yang, Kai-Chiang Wu, Hao-Yi Tsai, Chuei-Tang Wang +1 more | 2022-07-26 |
| RE49046 | Methods and apparatus for package on package devices | Ming-Kai Liu, Kai-Chiang Wu, Hsien-Wei Chen | 2022-04-19 |
| 11296012 | Barrier structures between external electrical connectors | Chia-Chun Miao, Kai-Chiang Wu | 2022-04-05 |
| 11171109 | Techniques for forming semiconductor device packages and related packages, intermediate products, and methods | Po Chih Yang, Yu-Jen Chen, Po Chen Kuo | 2021-11-09 |
| 11114357 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Ching-Feng Yang | 2021-09-07 |
| 11101238 | Surface mounting semiconductor components | Ming-Kai Liu, Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Yen-Ping Wang +1 more | 2021-08-24 |
| 10985117 | Solder ball protection in packages | Chia-Chun Miao, Kai-Chiang Wu | 2021-04-20 |
| 10971463 | Interconnection structure including a metal post encapsulated by a joint material having concave outer surface | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Ching-Feng Yang +2 more | 2021-04-06 |
| 10867957 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Ching-Feng Yang +2 more | 2020-12-15 |
| 10522437 | Methods and apparatus for package with interposers | Chun-Lin Lu, Kai-Chiang Wu, Yen-Ping Wang, Ching-Feng Yang | 2019-12-31 |
| 10510689 | Solder ball protection in packages | Chia-Chun Miao, Kai-Chiang Wu | 2019-12-17 |
| 10497646 | Dual-mode wireless charging device | Hung-Yi Kuo, Hao-Yi Tsai, Ming Hung Tseng, Hsien-Ming Tu | 2019-12-03 |
| 10347563 | Barrier structures between external electrical connectors | Chia-Chun Miao, Kai-Chiang Wu | 2019-07-09 |
| 10312209 | Manufacturing method of semiconductor package | Chao-Wen Shih, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Yen-Ping Wang | 2019-06-04 |
| 10269588 | Integrated circuit underfill scheme | Chun-Lin Lu, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao +1 more | 2019-04-23 |
| 10269737 | Method for manufacturing semiconductor structure | Chang-Pin Huang, Hsien-Ming Tu, Ching-Jung Yang, Hung-Yi Kuo, Yu-Chia Lai +3 more | 2019-04-23 |
| 10163846 | Mechanisms for forming hybrid bonding structures with elongated bumps | Chun-Lin Lu, Kai-Chiang Wu, Ming-Kai Liu, Yen-Ping Wang, Ching-Feng Yang +2 more | 2018-12-25 |
| 10157900 | Semiconductor structure and manufacturing method thereof | Hsin-Yu Pan, Kai-Chiang Wu, Ching-Feng Yang, Ming-Kai Liu, Chia-Chun Miao | 2018-12-18 |